3M & SUSS announce agreement on temporary wafer ... - I-Micronews
3M & SUSS announce agreement on temporary wafer ... - I-Micronews
3M & SUSS announce agreement on temporary wafer ... - I-Micronews
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Logic<br />
eFlash<br />
eDRAM<br />
Analog<br />
RF + I/Os<br />
Interposer<br />
TO BE<br />
RELEASED IN<br />
AUGUST 2009<br />
IPD – 2009 Report<br />
Technologies, Applicati<strong>on</strong>s, Markets & Players<br />
The first complete study <strong>on</strong> Thin Film Integrated Passive & Active Devices<br />
IPD can be used as <strong>wafer</strong>-level<br />
packaged single chip soluti<strong>on</strong>s for<br />
interface c<strong>on</strong>diti<strong>on</strong>ing, or they can<br />
be assembled with active IC’s in<br />
Systems-in-a-Package, or they can be<br />
used as package substrates or as<br />
system sub mounts.<br />
Wireless SiP Module Technology Trend<br />
IPDs are also a nice example of a mix of<br />
technologies as both IC and MEMS worlds<br />
meet here, to offer higher performance<br />
with high integrati<strong>on</strong>.<br />
Our report is the first covering technology<br />
review for thin film IPD, descripti<strong>on</strong> of the<br />
applicati<strong>on</strong>s, market forecasts, roadmaps<br />
& manufacturing challenges, descripti<strong>on</strong><br />
of the supply chain with players profiles.<br />
Courtesy of ASE<br />
Devices / Stati<strong>on</strong>s<br />
Applicati<strong>on</strong>s / Market windows for IPDs<br />
Network &<br />
Server<br />
Equipments<br />
Next Gen. Gaming<br />
LED lighting<br />
Set-Top Box<br />
Industrial &<br />
Home<br />
Networking<br />
> 10M<br />
units<br />
HDTV<br />
Automotive<br />
Car Electr<strong>on</strong>ic<br />
Lower Volumes<br />
MOTIVATIONS:<br />
• Smaller Size & Lighter Weight<br />
• Innovative Functi<strong>on</strong> & Flexible Design<br />
• Integrated System<br />
• High Electrical Performance<br />
• Low Cost & Time to Market<br />
> 100M units<br />
DSC<br />
Medical<br />
Electr<strong>on</strong>ic<br />
Mil &<br />
Aerospace<br />
> 1M units<br />
> 1B units<br />
High Volume<br />
PMP<br />
Netbook<br />
& MID<br />
Mobile ph<strong>on</strong>es<br />
For more informati<strong>on</strong>, please enter in c<strong>on</strong>tact with David Jourdan<br />
(jourdan@yole.fr - +33 472 83 01 90)<br />
Editorial Staff<br />
- Managing Editor : Jean-Christophe Eloy - Editor in chief : Dr Eric Mounier -<br />
Editor: Jérôme Bar<strong>on</strong><br />
- Advertising: Sandrine Leroy<br />
- Graphic design engineer: Flora Courtin<br />
Printed <strong>on</strong> recycled paper<br />
For more informati<strong>on</strong> <strong>on</strong>:<br />
- This newsletter, please ask our 3D IC project team: Jérôme Bar<strong>on</strong> (bar<strong>on</strong>@yole.fr) and Dr Eric<br />
Mounier (mounier@yole.fr)<br />
- Advanced packaging reports & Database at Yole Développement, please ask David Jourdan<br />
(jourdan@yole.fr)<br />
Read us <strong>on</strong> line at<br />
www.i-micr<strong>on</strong>ews.com
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