3M & SUSS announce agreement on temporary wafer ... - I-Micronews

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N e w s l e t t e r o n 3 D I C , T S V , W L P & E m b e d d e d T e c h n o l o g i e s
NXP to sell French fab in Caen: Spin-out of new 3-D IC Company ahead
Dutch semiconductor specialist NXP Semiconductors <strong>announce</strong>d plans to sell its French production unit in Caen to a
group of unnamed investors, ADP News reported on 22 April 2009.
The new owners will set up a new company to
engage in the 3-D technology sector and employ
a staff of 90 people. The company did not disclose
financial details, but said that it hopes to close the
deal by the end of April, and the new company will
start activity by mid-May. Some of the plant's assets
will be purchased by the new shareholders. NXP
<strong>announce</strong>d its first intentions to sell the French plant
in September 2008, but met with protests of trade
unions and local institutions.
www.nxp.com
Rudolph Technologies & SEMATECH extend
collaboration on 3D TSV process control
Rudolph Technologies and SEMATECH
<strong>announce</strong>d today that Rudolph has joined
SEMATECH’s 3D Interconnect Program at the
College of Nanoscale Science and Engineering
(CNSE) of the University at Albany. The joint
partnership is a continuation of collaborative efforts
in process characterization, with a new focus on 3D
IC (three-dimensional integrated circuits) processing
and enhancing process control of TSV (throughsilicon
vias) manufacturing. This is the second year
that Rudolph will serve as a Member of SEMATECH.
As a member of SEMATECH's 3D program,
Rudolph's inspection and metrology technologies
will be applied to various projects including via depth
and CD metrology, metallization void detection,
stacked wafer via alignment, wafer edge defect
detection and bump height coplanarity.
www.rudolphtech.com
Rudolph NSX inspection tool for 3-D structures
Rudolph <strong>announce</strong>s new 3D IC metrology tool for copper thickness
measurements
Rudolph Technologies <strong>announce</strong>d the availability
of its new MetaPULSE(R)-G thin film
measurement tool optimized specifically for copper
damascene processes at 45nm through 22nm
technology nodes and copper via fill in new 3D IC
applications. Copper thickness and overburden
measurements are critical in optimizing the CMP
process that follows deposition during through-silicon
via (TSV) manufacturing. The new tool measures
60-80 product wafers per hour with gauge-capable
precision and reduced cost of ownership. Rudolph is
accepting orders now with initial shipments planned
for the fourth quarter of 2009.
www.rudolphtech.com
<strong>3M</strong> & <strong>SUSS</strong> <strong>announce</strong> <strong>agreement</strong> on temporary wafer bonding
technology to enable 3-D IC semiconductors
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This is particularly important in the multiple hightemperature
cycles required in subsequent wafer
processing steps. After processing, <strong>3M</strong>’s unique
Light-To-Heat Conversion layer allows low stress,
room temperature debonding of the thinned wafer
directly to the tape carrier.
The thinned wafer is supported throughout the entire
process reducing warpage, stress and process
complexity compared to other processes that require
high-temperature exposure and stress to the thinned
wafer, or solvents to release the temporary bonding
material. <strong>3M</strong>’s WSS enables wafer processing
currently in high-volume production at multiple
semiconductor sites worldwide. “<strong>SUSS</strong> MicroTec is a
recognized leader in wafer bonding and applications
for 3-D and MEMS markets. Working with an industry
leader, like <strong>SUSS</strong>, allows <strong>3M</strong> to focus on advanced
materials development. The joint efforts of both
companies provide <strong>3M</strong> customers with improved
support, lower overall costs and faster access
to more advanced solutions for their demanding
3-D packaging requirements,” commented Mike
Bowman, marketing development manager for <strong>3M</strong>
Electronics Markets Materials Division. “We are
pleased to collaborate with a leading material expert
like <strong>3M</strong> to offer customers a leading edge temporary
bonding process with superior performance
compared to current materials and processes on the
market,” said Wilfried Bair, general manager, Wafer
Bonder Division, <strong>SUSS</strong> MicroTec. “This relationship
and process offering fits nicely with <strong>SUSS</strong> MicroTec’s
3-D strategy to provide a flexible and modular
bonding platform that can be configured to meet
customers’ needs.”
www.<strong>3M</strong>.com
Alchimer raises $10 million to expand global customer support and
broaden new IP development
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e expect Alchimer to make a significant
“Wcontribution to 3D-packaging technology,
which will play an important role in the development
of next-generation devices,” said Jean-Philippe
Stefanini, general partner of Grenoble, Francebased
Emertec Gestion. “Alchimer is an ideal fit for
our portfolio, and we have great confidence in its
experienced management team.”
“The continued support of investors, especially
in this difficult economic environment, is a solid
endorsement of Alchimer’s innovative technology,”
said Alchimer CEO Steve Lerner. “It also underscores
the impact of Alchimer’s electrografting technology in
enabling the emerging 3D market through process
enhancement and cost reduction.”
Alchimer recently <strong>announce</strong>d an enhancement of its
eG ViaCoat process for the copper seed metallization
of through-silicon vias (TSVs), which are used to
create interconnections in advanced 3D-packaging
applications. These structures are typically very
narrow in comparison to their depth; this high
aspect ratio creates a number of challenges to the
deposition of uniform films. The eG ViaCoat process
uses chemicals to deposit these films at levels of
uniformity that meet or exceed standard industry
quality metrics. In addition to having a number of
process advantages, this “wet” approach allows the
eG ViaCoat to be implemented on legacy plating
equipment without retrofits or modifications.
In further evidence of the company’s increasing
acceptance as a low-cost alternative for TSV copper
seed and related films, Alchimer <strong>announce</strong>d that it
has signed an <strong>agreement</strong> with Nagase & Co. Ltd.,
a Tokyo-based technology-marketing company with
an extensive background in chemicals, plastics and
electronics. Nagase will help Alchimer meet rapidly
increasing demand from key Japanese customers.
www.alchimer.com
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