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N e w s l e t t e r o n 3 D I C , T S V , W L P & E m b e d d e d T e c h n o l o g i e s
C O M P A N Y P R O F I L E
IPD – 2009 Report - Technologies, Applications, Markets & Players
The first complete study on Thin Film Integrated Passive & Active Devices
Market trends
From a commodity technology initially developed to
replace bulky discrete passive components, thinfilm
Integrated Passive Devices (IPD’s) are now a
growing industry trend.
They compete with discrete passive components on
the one hand, and with organic or ceramic-based
thick-film integrated passive devices on the other.
They can be used as wafer-level packaged single
chip solutions for interface conditioning, or they can
be assembled with active IC’s in Systems-in-a-
Package (SiP), or they can be used as package
substrates or as system sub mounts. Based on IC
and MEMS manufacturing technology, IPD’s offer
designers miniature integration while maintaining
high performance levels.
Wireless SiP Module Technology Trend
Logic
eFlash
eDRAM
Analog
RF + I/Os
Interposer
Whether it is to reduce space on the application
board, to enhance performance or to reduce cost at
the system level, IPD’s are spreading to most
electronic sectors, from low volume to mass market
businesses in aerospace, military, medical, industrial,
lighting, communications, and PC applications.
Over just a few years, IPD’s have become an
essential enabler of System-in-Package (SiP) and
heterogeneous integration in general. They greatly
contribute to bridging the increasing gap between
the ever-shrinking geometries of CMOS IC’s and the
lagging packaging technologies, while allowing the
integration of such diverse electronic functions as
sensors, MEMS, RF receivers, transmitters, power
amplifiers, power management units and digital
Courtesy of ASE
Wireless SiP Module Technology Trend
processors together into increasingly complete and
autonomous systems.
More than just a new packaging technique, and quite
different from regular Integrated Circuit technologies,
thin-film IPD’s truly import packaging into the clean
room and are about to extend the use of Wafer-Level
Packaging (WLP) not only to most IC package
platforms but to the industry of discrete passive
components as well. As a bridging technology, IPD’s
involve the complete semiconductor value chain:
from equipment and material suppliers to fabless
IDMs to foundries to substrate suppliers to OSATs
and OEMs. Yole estimates the total IPD market to
represent more than $600M this year and we expect
it to reach $1B by 2013.
In this report, you will find comprehensive links
between the technologies and their applications, as
well as the market sizes by application and the
market share and strategies of the major players.
The technology trends and the challenges to be
addressed are detailed, and market segment
forecasts up to 2015 are given.
Applications / Market windows for IPDs
Network &
Server
Equipments
Next Gen. Gaming
Devices / Stations
LED lighting
Set-Top Box
Industrial &
Home Automotive
Networking Car Electronic
> 10M
units
HDTV
Lower Volumes
Medical
Electronic
MOTIVATIONS:
• Smaller Size & Lighter Weight
• Innovative Function & Flexible Design
• Integrated System
• High Electrical Performance
• Low Cost & Time to Market
> 100M units
DSC
> 1M units
Netbook
& MID
Mil &
Aerospace
> 1B units
High Volume
PMP
Mobile phones
This report not only describes the market
and the associated technologies deep
inside the applications, but it also provides a
broad overview of the thin-film IPD market and
forthcoming growth opportunities.
Who should buy this report?
IPD manufacturers
Foundries -
Integrated semiconductor Device
Manufacturers
Assembly and Test Service companies
Electronic module makers and Original
Equipment Makers
Equipment and Material manufacturers
PCB manufacturers
Discrete component makers
Financial and strategic investors
For more information, please contact
Davi Jourdan at jourdan@yole.fr
Printed on recycled paper
Applications / Market windows for IPDs
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