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SESHA 2011 Program Book - Semiconductor Safety Association

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sponsored by IBM found that contact with less than 1<br />

milliliter of a 12% or 25% TMAH solution was lethal<br />

within 3 hours. IBM investigated possible underlying<br />

mechanisms of acute systemic toxicity including the direct<br />

effects on neurotransmission and on blood gases.<br />

IBM took prompt action to assess and, where necessary,<br />

enhance the health and safety procedures associated<br />

with TMAH based on the results of these animal studies.<br />

IBM notified the US EPA under the significant new<br />

information provisions of the Toxic Substances Control<br />

Act, Section 8e. Furthermore, IBM modified internal<br />

chemical labels for formulations containing TMAH,<br />

sponsored chemical-resistant glove and coverall permeation<br />

testing on TMAH solutions, performed process<br />

reviews on specific TMAH-using operations, and notified<br />

employees and contractors of the potential hazard.<br />

IBM implemented vigorous controls on the introduction<br />

of new processes employing concentrated TMAH<br />

solutions. Senior management is briefed on the potential<br />

hazards of the process, the tool and engineering<br />

requirements, and the availability of potential alternatives<br />

to TMAH. IBM develops work plans to reduce or<br />

eliminate potential TMAH hazards. In addition, IBM is<br />

working in cooperation with several development partners<br />

and suppliers to identify less hazardous alternatives<br />

to TMAH.<br />

4:30 pm The Integration of a Toxic Gas Monitoring<br />

System into the Building Fire Alarm System<br />

Sweeney, J; Harvard University<br />

Many facilities have toxic gas monitoring systems<br />

(TGMS) with local strobes to evacuate just clean rooms<br />

and affiliated areas. However, many facilities do not integrate<br />

their toxic gas monitoring systems into the building<br />

fire alarms systems. This presentation will describe<br />

three different types of toxic gas monitoring systems in<br />

a university setting and will describe how all three systems<br />

are integrated into the perspective building fire alarm<br />

systems. Topics of interest in this presentation will be as<br />

follows: 1. Details on TGMS Alarm level set points for<br />

exhaust and ambient gas sensors and when they trigger<br />

the building fire alarm systems; 2. Overview of how the<br />

two systems are integrated 3. Reasons for integrating the<br />

two systems; 4. Training details for all personnel involved<br />

in this new integrated system. In a university setting, the<br />

various working groups involved during emergencies<br />

are more expansive than in an industry setting. Types of<br />

people trained on the system (campus police, local fire<br />

fighters, facilities personnel, university operations center<br />

(24/7 hotline), EH&S department responders, building<br />

occupants etc).<br />

9<br />

1:45-5:15 pm<br />

GHG<br />

Sonora C<br />

1:45 pm Compliance Techniques for New Greenhouse<br />

Gas Regulations<br />

Higgs, T; Intel<br />

New greenhouse gas regulations pertaining to<br />

emissions reporting and facility permitting will impose<br />

multiple new requirements on semiconductor manufacturers<br />

and others in the electronics industries. The mandatory<br />

reporting rule for additional sources of fluorinated<br />

greenhouse gases (40CFR Part 98, subpart I) will<br />

require new approaches for measuring emissions, tracking<br />

inventories of fluorinated gases and heat transfer fluids,<br />

and add extensive new recordkeeping and reporting<br />

requirements. The Prevention of Significant Deterioration<br />

and Title V Greenhouse Gas Tailoring Rule (40CFR<br />

Parts 51, 52, 70 et. al.) will subject many sources to major<br />

source permitting requirements that have previously<br />

been able to avoid such requirements. These sources are<br />

likely to experience greatly increased requirements to<br />

understand and manage emissions impacts of routine<br />

changes, and significantly increased monitoring, reporting<br />

and recordkeeping burden. This presentation will<br />

examine compliance techniques for meeting the new<br />

requirements, and possible approaches for reducing the<br />

burden.<br />

2:30 pm PFC Stack Emissions Testing<br />

Inloes, S; WaferTech<br />

The goal of this testing was to determine if stack<br />

testing could be used to replace recipe specific testing<br />

required in the federal reporting rule. During February<br />

of <strong>2011</strong>, the SIA stack testing subcommittee developed<br />

the various stack testing options for testing emissions<br />

from electronic manufacturing Fabs. Various test methods<br />

were considered with the criteria determined to be<br />

1-10 ppb detection level . This equated to Fab emission<br />

of 1,000 to 40,000 MT CO2 eq depending on the Fab’s<br />

exhaust rate. Our site used GM/MS method to determine<br />

the concentrations of PFC’s and collection the samples<br />

using Summa containers. This method requires one-two<br />

days of onsite sample collection by a local emission testing<br />

company. Our process PFC emissions are routed to<br />

five acid scrubber stacks. In April of <strong>2011</strong>, we tested<br />

the five acid scrubbers simultaneously to reduce any<br />

variability of the site wide data. During the collection<br />

of the samples daily PFC gas usage data was collected<br />

and tier 2 emissions were compared to stack test results.

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