SESHA 2011 Program Book - Semiconductor Safety Association

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1:00-5:15 pm Emerging Codes Sonora A 1:00 pm Air Permitting Wafer Fabs Sherer, M; Sherer Consulting Services, Inc. Semiconductor fabs have complex processes that emit numerous process gases and byproducts. This presentation will provide information on developing calculation methodologies for air permitting, including byproducts. Strategies for air permitting will also be presented. 1:45 pm Complying with 1-Hour NO 2 NAAQS Davis, B; Zephyr Environmental Corp. The US EPA has recently promulgated a totally new short term National Ambient Air Quality Standard (NAAQS) for NO 2 . This 1-hour standard became effective April 12, 2010 and is set at 100 parts per billion (ppb) or 188 micrograms per cubic meter (μg/m3). For premit activity to authorize new or modified combustion sources, site wide modeling to demonstrate compliance with the 1-hour NO 2 NAAQS is likely to be required. The presentation will inform the audience that non-compliance is common, often due to emissions from emergency engines. Techniques for modifying sources and operations to improve modeling results will be detailed. 2:30 pm Implementing ISO 13849-1; An Equipment Manufacture’s Perspective Fessler, M; Tokyo Electron U.S. Holdings, Inc. Performance Level’s: Why Now? Current semiconductor equipment design standards already reference ISO 13849-1, but not many engineering teams have taken the leap to implement yet. Currently both EN 954-1 (1996) and ISO 13849-1 (2006) can be used by the equipment builders, users and integrators to help prove their presumption of conformity to the Machinery Directive (2006/42/EC). It’s important for us remember that after Dec 31st, 2011, only EN ISO 13849-1(2008) may be used for this purpose. There are different arguments being made on when we should implement. The proponents of the standard say that protective measures have evolved to keep pace with the increasing automation complexity, and that customer’s want to future proof their machines. Additionally, it is specifically mentioned multiple places within two semiconductor specific design guides (EN 60204-33, Section 9 and SEMI S2 Sections 11, 12, and RI 13. The “naysayers” say that its overkill and not needed, as our equipment leads the world in safe design/manufacturing. Additionally, both 12 the Machinery Directive and SEMI S2 guideline allows for a risk based approach which permits certification without following this specific harmonized standard (e.g conforms to performance goal versus conforms to stated criteria). It has also been viewed as being overlycomplicated (fear factor to undertake). TEL U.S’s. Product EHS embarked on task of applying ISO 13849-1 to one of our new equipment’s design within a US-based TEL Engineering Group, and its will be evaluated as a learning tool for other TEL Engineering groups in Japan. Roadblocks and lessons learned will be shared. 3:15 pm Break & Raffle Drawing, Exhibit Hall 3:45 pm Fire Safety Compliance - Why Are My Fire Safety Systems Not SEMI S2 Compliant? Wyman, M; KFPI Fire Protection Safety & Compliance is clearly defined by SEMI S2 in Chapter 14. In fact, Chapter 14 encompasses over 4 pages of the SEMI S2 document to detail “Fire Risk Assessment”, “Fire Risk Reduction”, “Fire Detection”, and “Fire Suppression” design and compliance. Also, SEMI S14 is another entire SEMI document dedicated to Fire Risk Assessment & Mitigation. However, when it comes to actual fire protection system integration into semiconductor equipment, it appears that no one actually reviews to make sure the fire safety system is compliant. KFPI has performed numerous 3rd Party inspections and audits of existing semiconductor equipment fire protection systems installed worldwide. KFPI will uncover the numerous fire protection non-compliance issues they have discovered in fabs around the world, many of which were supplied by the tool manufacturer. We will then explain the resulting fire safety hazard for each violation found. Issues include inadequate design, lack of supervision, improper application, improper installation, and imitation equipment. 4:30 pm Around the World Chemical Tour Graunke, D, Majors, M Several countries, including the US, are reviewing their chemical strategies, taking a close look at EU REACH. Could this mean harmonized global chemical regulaitons? Harmonizing chemical legislation in all countries would be extremely complicated because of variations in government structures. This presentation will take a tour of current and pending chemical regulations around the globe with a focus on potential impacts to the supply chain, importer requirements, and what it takes to import/export a chemical around the world.
10:00-11:30 am CSR Sonora B 10:00 am The Business Case for Integrating ESG Niekerk, G, Fallender, S, Zeller, E; Intel Corporation ESG (Environmental, Social and Governance) performance indicators and metrics have been used for several years by socially minded investors to make investment decisions; however, companies have had a difficult time applying similar metrics for internal business decisions that go beyond traditional ROI. Intel developed a framework to review our environmental, social and governance activities and practices in terms of their impact along four main business dimensions: (1) Risk Management: Protecting our license to operate, maintaining constructive relationships with local communities, and mitigating risk and promoting responsibility throughout our supply chain; (2) Operations: Building a strong talent pipeline, increasing employee engagement, and achieving cost savings and greater efficiency through sustainable business practices; (3) Revenue: Contributing to growth and product innovation; and (4) Brand: Enhancing our reputation and goodwill with stakeholders and becoming a trusted partner. This framework provides Intel a method of evaluating and describing the various ways in which our integrated approach to ESG factors creates value for Intel; by making decisions that optimize long-term shareholder value and effectively articulate internal and external value generated from our activities. 10:45 am Implementation Strategy for Corporate Social Responsibility (CSR) at ON Semiconductor Evans, K, McCarley, T, Amorin, P; ON Semiconductor Implementation Strategy for Corporate Social Responsibility (CSR) at ON Semiconductor Keenan Evans, Theresa McCarley and Pam Amorin ON Semiconductor 5005 E. McDowell Rd. Phoenix, AZ 85008 The term Corporate Social Responsibility (CSR) encompasses corporate governance, environmental due diligence and sustainability, worker rights, and health and safety considerations. In response to the social needs and desires driven by company stakeholders (shareholders, customers, employees and the local communities where companies do business), there has been a surge of CSR activity in all aspects of business (manufacturing, services, etc.). This activity requires companies to formally demonstrate they are good global corporate citizens wherever they do business. In order to align with the global electronics community and to formalize and organize 13 our various CSR efforts, On Semiconductor became an applicant member of the Electronic Industry Citizenship Coalition (EICC) in mid-2009 and we became a full member of the EICC in December of 2010. We had previously endorsed the EICC code of conduct and we had a number of programs already in place to ensure compliance to the various tenets of the code, including a long established code of business conduct and formal certification to the ISO14001 environmental management system standard. This presentation/discussion will explore our ‘current state’ of CSR globally and focus on our implementation and management strategy internally within our own facilities and externally with our supply chain. The presentation/discussion will incorporate an overview on the impact of recent legislation regarding conflict metals and human rights. 11:30 am Cash & Carry Lunch, Exhibit Hall 1:00-5:15 pm Waste Minimization Sonora B 1:00 pm Recovering Semiconductor Manufacturing Materials Parker, R, Atkinson, B, Bradshaw, J; Freescale Semiconductor, E2CS, Intel Recovering Semiconductor Manufacturing Materials Semiconductor Scrap Management Program Objectives -Environmental Stewardship -Intellectual Property Protection -Maximization of potential revenues How to accomplish these objectives -Follow established internal corporate policies for reclaim -Contracting with reclaim/ recycler (s) that understands complex semiconductor scrap materials. -Final scrap recovery through Integrated Smelter process. Structure of the Recycling Chain – In essence…. There are only six integrated smelters in the world that have been modified to process the complex materials contained in semiconductor scrap. Environmental Stewardship: -The current Best Available Technology for final processing of Semiconductor complex scrap to elements is an integrated smelter. -Integrated Smelter technology represents massive capital investments and these smelters exist only in Canada, Germany, Belgium, Sweden, Japan and Australia. The Recycling Chain and your Company Utilize Best Available Environmental Technology Understanding Semiconductor Scrap Materials The reasons for and benefits of the lot# system are: Descriptions of Semiconductor Scrap Semiconductor Scrap Management Program Objectives – Continued The reclaim chain of custody: Security can help prevent E-Waste theft
Page 1 and 2: SESHA & SIA PRESENT THE 33rd ANNUAL
Page 3 and 4: SESHA 33rd Annual International Hig
Page 5 and 6: Professional Development Courses Mo
Page 7 and 8: will be highlighted. Point-of-Use (
Page 9 and 10: Tuesday 8:00-9:30 am Opening Ceremo
Page 11 and 12: sponsored by IBM found that contact
Page 13: product is 12-inches wafer, and it
Page 17 and 18: 3:15 pm Break & Raffle Drawing, Exh
Page 19 and 20: end-of-life disposal and recycling.
Page 21 and 22: abatement device effluents. This st
Page 23 and 24: 10:00 am-3:15 pm Risk Management So
Page 25 and 26: stakeholder events and solicits inp
Page 27 and 28: William R. Acorn, PE, FASHRAE Willi
Page 29 and 30: Lisy. His research involved impleme
Page 31 and 32: health and safety programs in both
Page 33 and 34: a BA cum laude in Philosophy and An
Page 35 and 36: Exhibitors Don’t Miss these Exhib
Page 37 and 38: up with new technologies and never

SESHA 2011 Program Book - Semiconductor Safety Association

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