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SESHA 2011 Program Book - Semiconductor Safety Association

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end-of-life disposal and recycling. This presentation will<br />

provide insight and lessons learned from First Solar’s life<br />

cycle management approach and it’s leading-edge efforts<br />

to implement a comprehensive environmental plan. Given<br />

the significant growth of the CdTe PV technology and its<br />

rapid deployment in the field it is critical that environmental<br />

impact data continue to be collected, analyzed, made<br />

public, and updated. In this presentation First Solar will<br />

provide an overview of its experiences and best practices<br />

in developing large-scale PV projects, including detailing<br />

the benefits and impacts of utility-scale PV projects<br />

on a life cycle basis. By the end of 2010, a total of more<br />

than 30GW of PV capacity will have been installed worldwide,<br />

and what happens to these products at the end of<br />

their useful life needs to be addressed. With a commitment<br />

to extended producer responsibility, First Solar, a leading<br />

manufacturer and developer of large scale projects, has<br />

implemented a comprehensive pre-funded module collection<br />

and recycling program. This presentation will provide<br />

details on how the overall program is designed to be convenient,<br />

unconditional, and free. First Solar will also share<br />

updated information on the recycling technology it has<br />

developed and implemented on a commercial scale ensuring<br />

that substantially all module components (by mass)<br />

are recovered for reuse in new solar modules or new glass<br />

products. By offering a collection and recycling program,<br />

the largest CdTe PV manufacturer is proving today that it<br />

is possible to manage waste concerns for the future while<br />

creating truly sustainable energy solutions today.<br />

2:30 pm GHG Reporting for the Electronics Industry<br />

- Determination of Reporting Applicability<br />

Cotter, D; Capaccio Environmental Engineering, Inc.<br />

Mr. Cotter will present a review of the U.S. EPA’s<br />

recently promulgated greenhouse gas (GHG) reporting<br />

rule for the electronics manufacturing industry (40 CFR<br />

Part 98, Subpart I). The presentation will include a review<br />

of the rule’s applicability criteria and how to use<br />

the equations in the regulation to determine applicability.<br />

The presentation will also discuss the rule’s requirements<br />

for monitoring, reporting, and record keeping,<br />

including the requirement to develop a written GHG<br />

monitoring plan by April 1, <strong>2011</strong>.<br />

3:15 pm Break & Raffle Drawing, Exhibit Hall<br />

17<br />

3:45-5:15 pm<br />

Disaster Preparedness Roundtable<br />

Sonora C<br />

3:45 pm Losses in the <strong>Semiconductor</strong> Industry –<br />

Case Studies and Lessons Learned<br />

Acorn , W; Acorn Consulting Services, LLC<br />

The author will discuss several large losses incurred<br />

by semiconductor and similar advanced manufacturing<br />

clients that resulted not only in business interruption,<br />

but significant out-of-pocket expenses. Case<br />

studies will address: 1. Fire in wafer fab – catastrophic<br />

losses, business interruption, lengthy litigation 2.<br />

Fire in flat panel display manufacturing facility - catastrophic<br />

losses, business interruption, lengthy litigation<br />

3. Chemical leak in wafer fab - catastrophic losses, business<br />

interruption, lengthy litigation 4. Alleged unsafe<br />

environments in wafer fabs result in employee claims<br />

and protracted lawsuits The author will address the impact<br />

of these cases not only from business interruption,<br />

but distraction of the owners’ employees from more productive<br />

endeavors.<br />

10:00 am-3:15 pm<br />

Abatement Strategies<br />

Sonora D<br />

10:00 am Point-of-Use Ammonium Compounds<br />

Removal - Keeping Exhaust Emission Clear<br />

Tsou, A, Chen, C-H, Hsiao, H-C; United Microelectronic<br />

Corp. (Singapore Branch), Singapore<br />

Hsuan-Chien Hsiao is with the United Microelectronic<br />

Corp. (Singapore Branch), No. 03, Pasir Ris Dr<br />

12, Singapore (Paul_Hsiao@umc.com) Chi-Hua Chen<br />

is with the United Microelectronic Corp. (Singapore<br />

Branch), No. 03, Pasir Ris Dr 12, Singapore Po-Wen Wu<br />

is with the United Microelectronic Corp., No. 3, Li-Hsin<br />

2nd Road, Hsinchu Science Park, Hsinchu, Taiwan 300,<br />

R.O.C. H-R Lai is with the United Microelectronic Corp.,<br />

No. 3, Li-Hsin 2nd Road, Hsinchu Science Park, Hsinchu,<br />

Taiwan 300, R.O.C. Abstract – Many wafer fabs face the<br />

challenge of managing effluent generated from compound<br />

semiconductor process-specific and that includes ensuring<br />

Point-of-use (POU) abatement devices meets the required<br />

or desired performance. For POU abatement systems, we<br />

usually focus on the main electric/fuel oxidation abatement<br />

mechanism but not on wet scrubbing section. It was<br />

found that poor abatement efficiencies of wet scrubbing<br />

could lead to environmental issues such as generation of<br />

fine particle at the stack and corrosion of exhaust duct.

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