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UAC 357xB ADVANCE INFORMATION AVDD − + AREG0/1 Suspend AVSS Fig. 5–20: Analog Voltage Supply Pins AVDD, AVSS, AREG0/1 VDD − + VREG VSS Fig. 5–21: Digital Voltage Supply Pins VDD, VSS, VREG 38 Aug. 20, 2004; 6251-650-1AI Micronas
ADVANCE INFORMATION UAC 357xB 5.6. Electrical Characteristics Abbreviations: tbd = to be defined vacant = not applicable positive current values mean current flowing into the chip 5.6.1. Absolute Maximum Ratings Stresses beyond those listed in the “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only. Functional operation of the device at these conditions is not implied. Exposure to absolute maximum rating conditions for extended periods will affect device reliability. This device contains circuitry to protect the inputs and outputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than absolute maximum-rated voltages to this high-impedance circuit. All voltages listed are referenced to ground except where noted. All GND pins must be connected to a low-resistive ground plane close to the IC. 5.6.2. Absolute Maximum Ratings Symbol Parameter Pin Name Min. Limit Values Max. Unit T A 5) Ambient Temperature −10 70 6) °C T C Case Temperature PQFN64-1 PMQFP64-2 – 120 120 °C °C T S Storage Temperature −40 125 °C P MAX Maximum Power Dissipation PQFN64-1 PMQFP64-2 – 1150 850 mW V SUPA Analog Supply Voltage 1) AVDD −0.3 6 V V SUPA Analog Supply Voltage 2) AVDD, AREG0/1 −0.3 6 V V SUPD Digital Supply Voltage VDD −0.3 6 V ∆V GRND Voltage Differences between different Grounds AVSS0, AVSS1, VSS −0.5 +0.5 V 1) Internal regulators used 2) If internal regulators are not used, connect AVDD to AREG0/1. 5) Measured on Micronas typical 2-layer (1s1p) board based on JESD - 51.2 Standard with maximum power consumption allowed for this package 6) A power-optimized board layout is recommended. The Case Operating Temperature mentioned in the “Absolute Maximum Ratings” must not be exceeded at worst case conditions of the application. Micronas Aug. 20, 2004; 6251-650-1AI 39
Page 1 and 2: Hardware Documentation Advance Info
Page 3 and 4: ADVANCE INFORMATION UAC 357xB Conte
Page 5 and 6: ADVANCE INFORMATION UAC 357xB HID a
Page 7 and 8: ADVANCE INFORMATION UAC 357xB 2.1.
Page 9 and 10: ADVANCE INFORMATION UAC 357xB 2.3.1
Page 19 and 20: ADVANCE INFORMATION UAC 357xB The a
Page 23 and 24: ADVANCE INFORMATION UAC 357xB The p
Page 25 and 26: ADVANCE INFORMATION UAC 357xB The n
Page 27 and 28: ADVANCE INFORMATION UAC 357xB Table
Page 29 and 30: ADVANCE INFORMATION UAC 357xB Fig.
Page 31 and 32: ADVANCE INFORMATION UAC 357xB Pin N
Page 37: ADVANCE INFORMATION UAC 357xB SREF
Page 45 and 46: ADVANCE INFORMATION UAC 357xB Symbo
Page 47 and 48: ADVANCE INFORMATION UAC 357xB Symbo
Page 51 and 52: ADVANCE INFORMATION UAC 357xB 6. UA
Page 53 and 54: ADVANCE INFORMATION UAC 357xB Micro

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