UAC 357xB - SemiconductorStore.com

ADVANCE INFORMATION
UAC 357xB
5.6. Electrical Characteristics
Abbreviations:
tbd = to be defined
vacant = not applicable
positive current values mean current flowing into the chip
5.6.1. Absolute Maximum Ratings
Stresses beyond those listed in the “Absolute Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only. Functional operation of the device at these conditions is not implied. Exposure to absolute
maximum rating conditions for extended periods will affect device reliability.
This device contains circuitry to protect the inputs and outputs against damage due to high static voltages or electric
fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than absolute
maximum-rated voltages to this high-impedance circuit.
All voltages listed are referenced to ground except where noted.
All GND pins must be connected to a low-resistive ground plane close to the IC.
5.6.2. Absolute Maximum Ratings
Symbol Parameter Pin
Name
Min.
Limit Values
Max.
Unit
T A
5)
Ambient Temperature −10 70 6) °C
T C
Case Temperature
PQFN64-1
PMQFP64-2
–
120
120
°C
°C
T S Storage Temperature −40 125 °C
P MAX
Maximum Power Dissipation
PQFN64-1
PMQFP64-2
–
1150
850
mW
V SUPA Analog Supply Voltage 1) AVDD −0.3 6 V
V SUPA Analog Supply Voltage 2) AVDD,
AREG0/1
−0.3 6 V
V SUPD Digital Supply Voltage VDD −0.3 6 V
∆V GRND
Voltage Differences between
different Grounds
AVSS0,
AVSS1,
VSS
−0.5 +0.5 V
1) Internal regulators used
2) If internal regulators are not used, connect AVDD to AREG0/1.
5) Measured on Micronas typical 2-layer (1s1p) board based on JESD - 51.2 Standard with maximum power
consumption allowed for this package
6) A power-optimized board layout is recommended. The Case Operating Temperature mentioned in the “Absolute
Maximum Ratings” must not be exceeded at worst case conditions of the application.
Micronas Aug. 20, 2004; 6251-650-1AI 39