Snap-Action Switches Detection Switches General Catalogue 2005

2. Right side hinge lever type
AGL
mm inch
1.0 dia.
.039 dia.
4.8
.189
4.0
.157
26.4 ±0.15
1.039 ±.006
TTP 3.6 .142 max.
O.P. 7.1 ±1.3 .280 ±.051
F.P. 10.1 .398 max.
12.5 ±0.15
.492 ±.006
5
.197
2.8 ±0.1
.110 ±.004
19.85
.781
15.35 ±0.15
.604 ±.006
2.4
.094
TTP 6.0 .236 max.
O.P. 9.5 ±1.3 .374 ±.051
F.P. 12.5 .492 max.
21.2
.835
19.45 ±0.2
.766 ±.008
12.25
.482
5.8
.228
12.5 .492
23.5 .925
27.8 1.094
34 1.339
2.8 ±0.1
.110 ±.004
3.5
.138
3. Left side hinge lever type
F.P. 10.1 .398 max.
O.P. 7.1 ±1.3 .280 ±.051
TTP 3.6 .142 max.
26.4 ±0.15
1.039 ±.006 4.0
.157
1.0 dia.
.039 dia.
4.8
.189
12.5 ±0.15
.492 ±.006
5
.197
F.P. 12.5 .492 max.
O.P. 9.5 ±1.3 .374 ±.051
TTP 6.0 .236 max.
2.4
.094
15.35 ±0.15
.604 ±.006
19.85
.781
21.2
.835
19.45 ±0.2
.766 ±.008
2.8 ±0.1
.110 ±.004
12.25
.482
5.8
.228
12.5 .492
23.5 .925
27.8 1.094
34 1.339
2.8 ±0.1
.110 ±.004
3.5
.138
NOTES
1. A and B of the figure below are the
additional terminals to fix the switch
body on the PC board. Since these
terminals are related No.1 terminal
and No.2 terminal respectively, please
be sure to maintain adequate
insulating clearance between each
terminal and ground.
A
No. 1 terminal
B
No. 2 terminal
2. In setting the movement after
operation, the over-travel should be
set from 70% to 100%. Setting the
movement less than 70% may cause
degrading the electrical mechanical
performance.
3. Soldering operation
Soldering must be done as quickly as
possible.
260°C 500°F: within 10 seconds
350°C 662°F: within 3 seconds
During the operation, care should be
taken to prevent flux entrance inside the
switch. The positioning tab may be
changed in shape.
4. Please pay attention to the
insulation distance between terminals
and between terminal and the ground
after mounting and wiring.
5. Environment
Avoid the location nearby the conductive
material which possibly attaches the
switch.
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