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62 United Microelectronics Corporation Annual Report 2004 Major Agreements Major Long-term Supply and Marketing Agreements In order to maintain a worldwide marketing presence, UMC has entered into long-term distribution, sales, service and support agreements. In addition, UMC has maintained a long-term supply business relationship with major wafer material vendors. The major contents of these agreements are described below: Company Name Contract Period Major Contents Limitations UMC Group (USA) 2004.1.1 ~ 2005.12.31 Semiconductor products sales and relevant services None material United Microelectronics (Europe) B.V. 2003.1.1 ~ 2004.12.31 Semiconductor products sales and relevant services None material Shin-Etsu Handotai Taiwan Co., Ltd. Indefinite period 150mm, 200mm and 300mm raw wafer supply None material Major License Agreements UMC is committed to the protection and enhancement of intellectual property. Based on over twenty years of investment, UMC has been awarded more US patents in the semiconductor field than any other independent foundry in the world. UMC also has cross-licensing agreements with major semiconductor patent holders to ensure that customers do not face infringement claims as a result of UMC services. Some of the major licenses include: Cross License (Company Name) License Period Fields of Protection Limitations Agere Systems Inc. 2004.1.1 ~ 2008.12.31 Process and topography None material International Business Machines Corporation 1998.8.1 ~ 2005.12.31 Process, topography and design None material Texas Instruments Incorporated 1998.8.28 ~ 2007.12.31 Process, topography and memory content None material
Operations Overview 63 Major Agreements (cont.) Major Joint Venture and Construction Agreements Company Name Contract Period Major Contents Limitations UMCi Pte Ltd, Infineon Technologies AG, EDB Investments Pte Ltd (Note 1: UMCi Pte Ltd had changed to “UMCi Ltd.” from 2003.10.8) (Note 2: The joint venture agreement with Infineon Technologies AG was terminated before 2004.1.1) Since 2001.3.30 UMC, UMCi, and EDB Investments entered into an amended and restated joint venture agreement concerning a facility in the Pasir Ris Wafer Fab Park in Singapore for the manufacture of 300mm wafers using leading edge technology. Pursuant to supplemental agreements entered in March of 2004, UMC repurchased the shares of the joint venture held by EDB Investments. None material Various construction or engineering companies, such as: L&K Engineering Co.,Ltd., Yi Shih Construction Co., Ltd., Yuan Lih Electrical Engineering Co., Ltd., Hueng Luei Process Industry Co., Ltd. 2004.1.1 ~ 2005.12.31 UMC has contracts with major construction and engineering companies to expand semiconductor facilities in the Tainan Science Park. Total contract amounts exceed NTD 1.6 billion. None material Major Long-term Loan Agreements UMC is committed to building and maintaining state-ofthe-art wafer fabrication facilities that will allow UMC to maintain its position as a premier independent wafer foundry and maintain the capacity needed to support its continued growth. In order to provide the necessary capital required to support such projects, UMC has, from time to time, obtained loans from commercial banks. Some of these loans include: Company Name Contract Period Major Contents Limitations Chiao Tung Bank Co., Ltd. and 9 other participant banks. (Note: This case had been paid off in 2004) Chiao Tung Bank Co., Ltd. and 17 other participant banks. (Note: This case had been paid off in 2004) Chiao Tung Bank Co., Ltd. and 8 other participant banks. (Note: This case had been paid off in 2004) Chiao Tung Bank Co., Ltd. and 13 other participant banks. (Note: This case had been paid off in 2004) The International Commercial Bank of China and 20 other participant banks. 1996.6.20 ~ 2004.4.11 Chiao Tung Bank Co., Ltd. arranged the syndicated loan and the facility amount was approximately NTD 4.3 billion. The loan was for Fab 8E’s capital expenditure. 1996.9.20 ~ 2005.5.26 Chiao Tung Bank Co., Ltd. arranged the syndicated loan and the facility amount was approximately NTD 12.3 billion. The loan was for Fab 8C’s capital expenditure. 1998.2.18 ~ 2005.9.18 Chiao Tung Bank Co., Ltd. arranged the syndicated loan and the facility amount was approximately NTD 4.3 billion. The loan was for Fab 8E’s capital expenditure. 1999.11.22 ~ 2007.9.25 Chiao Tung Bank Co., Ltd. arranged the syndicated loan and the facility amount was approximately NTD 3.9 billion. The loan was for Fab 8E’s capital expenditure. 2000.1.28 ~ 2007.1.28 The International Commercial Bank of China arranged the syndicated loan and the facility amount was approximately NTD 8 billion. The loan was for Fab 8F’s capital expenditure. None material None material None material None material None material
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THE SoC SOLUTION FOUNDRY United Mic
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united microelectronics corporation
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Financial Review Unconsolidated 67
Page 7 and 8:
Letter to Shareholders 5 packaging
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Letter to Shareholders 7 strategy,
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Era of the SoC 9 Remarkable progres
Page 13 and 14: Energy Efficiency SoCs can be used
Page 15 and 16: Automobile Security SoCs can be use
Page 17 and 18: Office Automation SoCs are found in
Page 19 and 20: Mobile Communications SoCs are foun
Page 21 and 22: Era of the SoC 19 Advanced Process
Page 23 and 24: Corporate Overview 21 Corporate Pro
Page 25 and 26: Corporate Overview 23 2000 > 2001 >
Page 27 and 28: Corporate Overview 25 Corporate Mar
Page 29 and 30: Corporate Overview 27 Experience Ed
Page 31 and 32: Corporate Overview 29 Directors’
Page 33 and 34: Corporate Overview 31 Experience Ed
Page 35 and 36: Corporate Overview 33 Transportatio
Page 37 and 38: Corporate Overview 35 Salary (In th
Page 39 and 40: Corporate Overview 37 Total Percent
Page 41 and 42: Corporate Overview 39 List of Major
Page 43 and 44: Corporate Overview 41 Employee Bonu
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Page 49 and 50: Corporate Overview 47 2003.12.23 20
Page 51 and 52: Corporate Overview 49 Employee Stoc
Page 53 and 54: Corporate Overview 51 Mergers and A
Page 55 and 56: Operations Overview 53 Business Sco
Page 57 and 58: Operations Overview 55 R&D Expendit
Page 59 and 60: Operations Overview 57 Market and S
Page 61 and 62: Operations Overview 59 Production a
Page 63: Operations Overview 61 Environmenta
Page 67 and 68: Financial Report 2004
Page 69 and 70: Financial Review Unconsolidated 67
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Financial Review Consolidated 117
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Financial Review Consolidated 119 R
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Financial Review Consolidated 121 I
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Financial Review Consolidated 123 C
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Financial Review Consolidated 125 F
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Financial Review Consolidated 127 i
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Financial Review Consolidated 129 S
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Financial Review Consolidated 131 (
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Financial Review Consolidated 133 A
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Financial Review Consolidated 135 t
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Financial Review Consolidated 137 i
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Financial Review Consolidated 139 d
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Financial Review Consolidated 141 a
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Financial Review Consolidated 143 c
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Financial Review Consolidated 149 N
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Financial Review Consolidated 151 b
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Financial Review Consolidated 153 N
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Review of Financial Position, Opera
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Affiliated Enterprises Overview 177
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Affiliated Enterprises Overview 179
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Special Disclosures 181 Status of I
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Special Disclosures 183 Major Resol
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Special Disclosures 185 Description
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The Disclosure According to US Secu
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The Disclosure According to US Secu
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