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Laser Lift-off Process

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Cross sectional SEM micrograph of a<br />

transferred GaN film onto a Si substrate<br />

GaN on Si by Pd-In bonding and<br />

laser lift-<strong>off</strong> (LLO)<br />

GaN LED on Si<br />

200 μm<br />

Pd-In metal bilayers were used as bonding material which formed the<br />

compound PdIn3 after the low-temperature bonding process.<br />

Cleaving the Si substrate was performed to make the cleavage facets on<br />

the GaN.<br />

InGaN LEDs on Si Substrates<br />

20<br />

10

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