Laser Lift-off Process

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Pattern transfer by LLO 7 Laser Lift-off technology 8 4
[William S. Wong, Michael Kneissl, David W. Treat, Mark Teepe, Naoko Miyashita, and Noble M. Johnson Electronic Materials Laboratory XEROX Palo Alto Research Center E-mail:wswong@parc.xerox.com] 10 5
Page 1 and 2: 7. An introduction to Laser Lift-O
Page 3: Bonding and transfer process 5 X-ra
Page 7 and 8: A simulated temperature profile as
Page 9 and 10: Approach to integration 17 Free-sta
Page 11 and 12: LLO integration process 21 Cleaved
Page 13 and 14: CW laser diodes on diamond 25 Impro
Page 15 and 16: Laser lift-off (LLO) technique Ther
Page 17 and 18: - 0.5 mm Start 0.5 mm 0.5 mm Laser
Page 19 and 20: 46 47 19
Page 21 and 22: 50 53 21
Page 23 and 24: Thermally induced decomposition of
Page 25 and 26: Comparison between the maximal etch
Page 27 and 28: Experimental results Image of a HVP
Page 29 and 30: Summary and conclusions The present
Page 31 and 32: 77 78 31
Page 33 and 34: 81 Process flow for bonding and tra
Page 35 and 36: Room-temperature dc I -V characteri
Page 37 and 38: Forward I-V curves and Room tempera
Page 39: I-V characteristics of chemically l

Laser Lift-off Process

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