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Device Testing1 & 2-d NanoElectronicsM—O—MAuAu0.5 umNiOMetal-Oxide-Metal (MOM)“Failure”NiO, TiO 2 , SnO 2 …AuAu2 um10 umTresback, et. al. IEEE Transactions on Nanotechnology, 6 [6] 676-81 (2007)
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Page 1 and 2: Metrology for NanofabricationThe Gr
Page 3 and 4: IntroductionMetrology:The Science o
Page 5 and 6: Metrology for Process ControlDATADe
Page 7 and 8: Optical MicroscopyCapabilities- Mor
Page 9 and 10: EllipsometryCapabilities-Polarized
Page 11 and 12: ProfilometryTwo Main Types of Profi
Page 13 and 14: Optical ProfilometryCCI HDWyko NT11
Page 15 and 16: Optical ProfilometryAuTiSiNiFe-40nm
Page 17 and 18: Optical ProfilometryElectrode Array
Page 19 and 20: Atomic Force Microsopy (AFM)Sub-Mic
Page 21 and 22: Atomic Force Microsopy (AFM)Ti/Au o
Page 23 and 24: Atomic Force Microsopy (AFM)Si12 um
Page 25 and 26: Thin Film Characterization-1200 °C
Page 27 and 28: Electronic ConductionHummel, R.E. E
Page 29 and 30: Electronic ConductionIntrinsic Semi
Page 31 and 32: Van der Pauw Hall and ResistivityMe
Page 37 and 38: Thin Film ElectricalCharacterizatio
Page 39 and 40: Resistivity (ohm-cm)Thin Film Chara
Page 41 and 42: Mobility (cm2/V*s)Resistivity (ohm-
Page 43: Device Testing1 & 2-d NanoElectroni

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