March - April 2010 - Chip Scale Review

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10Chip Scale Review. March/April 2010 . [ChipScaleReview.com]
the signature of apartnership withthe Americanbased company,Lewis and Clark, aprominent name inselling andJean-Marc Peallat servicing SMTsecond-handequipment. Both Lewis and Clark andVi Technology will extend theirproduct offerings. Lewis and Clark willbe able to service all Vi Technology’sAOI and SPI equipment frominstallation and basic operation toadvanced support. Vi Technology willintegrate the unique Lewis and Clarkexperience of trading used equipmentas new solution for customers.“This partnership seals a long termcollaboration between bothcompanies,” explained Jean-MarcPeallat, CEO, Vi Technology Inc. AddsFrank L. Clark, Jr., President/CEO, Lewisand Clark, “Our goal is to give ViTechnology’s customers timely serviceas well as the opportunity to trade inunused assets toward new VITequipment.”[www.vitechnology.com][www.lewis-clark.com]Rudolph Technologies Partnersin EuropeRudolph Technologies, Inc., aprovider of process characterizationequipment and software for wafer fabsand advanced packaging facilities,recently announced that it has selectedthe John P. Kummer Group to distributeits probe card test and analysis (PCTA)products in Europe, significantlyincreasing the sales and supportresources dedicated to PCTA systemsin critical European markets. The movewas made in anticipation of growingdemand as the semiconductormanufacturing industry continues itsrecovery and manufacturers look fornew methods to reduce the cost andoptimize the performance of their testingprocesses. “We are very pleased to beable to bring these resources to bear inour European operations,” said MartinMolan, general manager, RudolphTechnologies Europe. Rex Sandbach,director of Kummer UK adds, “We have15 years of experience in this and relatedmarkets.” [www.rudolphtech.com]Chip Scale Review. March/April 2010 . [ChipScaleReview.com] 11
Page 4 and 5: 2Chip Scale Review. March/April 201
Page 6: VOLUME 14, NUMBER 2FROM THE PUBLISH
Page 9 and 10: Chip Scale Review. March/April 2010
Page 11: well as for our customers in Asia w
Page 15 and 16: IC Assembly and Test Market Poisedf
Page 17 and 18: Honorable MentionCarsem (M) Sdn. Bh
Page 19 and 20: INTERNATIONAL DIRECTORY OF IC PACKA
Page 21 and 22: INTERNATIONAL DIRECTORY OF IC PACKA
Page 23 and 24: EconomicOutlook 2010By Sandra Winkl
Page 25 and 26: ● Fast chips must be mixed with s
Page 27 and 28: expensive “semiconductor” equip
Page 29 and 30: integration technology is far in th
Page 31 and 32: Next-Gen Advanced Packages Spell Op
Page 33 and 34: High Temperature Stack-chip, Die-at
Page 35 and 36: Figure 6. Specialty fill-in adhesiv
Page 37 and 38: INTERNATIONAL DIRECTORY OF WAFER-BU
Page 39 and 40: WHAT'S NEW!Nanoscale MEMS Made Insi
Page 41 and 42: PRODUCT SHOWCASECALENDARMay 19-21,

March - April 2010 - Chip Scale Review

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