March - April 2010 - Chip Scale Review

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INTERNATIONAL DIRECTORY OF IC PACKAGING FOUNDRIESCOMPANYHEADQUARTERSCompanyStreet AddressCity, State, CountryTelephoneWebsiteMANUFACTURINGLOCATIONSCountry (Qty)CN = ChinaID = IndonesiaIN = IndiaIT = ItalyJP = JapanKR = KoreaMX = MexicoMY = MalaysiaPH = PhilippinesSG = SingaporeTH = ThailandTW = TaiwanUK = United KingdomUS = United StatesPACKAGETYPESCeramicCB = Ball ArrayCL = Leads/PinsCN = No LeadsPlastic (Molded)PB = Ball ArrayPL = Leads/PinsPN = No LeadsPlastic (No Mold)PC = Cavity/DamPF = Film/TapeOtherWL = Wafer LevelMC = Memory CardCONTRACTSERVICESSD = Substrate DesignBP = Wafer BumpingWP = Wafer ProbingWD = Wafer DicingWT = Wafer ThinningAS = AssemblyFT = Final TestET = Environmental TestBI = Burn-InASSEMBLYPROCESSESAD = Adhesive/GlassED = Eutectic/SolderWB = Wire BondFC = Flip ChipGT = Glob TopMP = Molded PlasticUF = UnderfillLP = Lead PlatingBA = Ball AttachLA = Lead AttachHS = Hermetic SealSPEL Semiconductor Ltd.5 CMDA Industrial Estate,MM Nagar (Chennai) 603209, IndiaTel: +91-44-4740-5473www.spel.comIN(1)PL, PNSD, WPWD, WT ?AS, FTETAD, WBMP, LPStars Microelectronics (Thailand)Public Co., Ltd.605-606 Moo 2, EPZ,Bang Pa-In Industrial Estate,Klongjig, Bang Pa-In, Ayutthaya 13160,ThailandTel: +66-35-221-777www.starsmicroelectronics.comTH(2)PL, PNSD, WDAS, FTETAD, WBMP, LPSTATS-ChipPAC Ltd.10 Ang Mo Kio Street 65,#05-17/20 Technopoint,Singapore 569059Tel: +65-6824-7777www.statschippac.comCN(1), KR(1)MY(1), SG(1)TH(1), TW(1)US(2)PB, PL, PNWLSD, BPWP, FTWD, WTAS, ETAD, WBFC, UFMP, LPBATaiwan IC Packaging Corporation2, South 3 Road,Kaohsiung Export Processing ZoneKaohsiung, Taiwan R.O.C.Tel: +886-7-815-8800www.ticp.com.twTW(1)PL, PNMCSD, WDAS, FTAD, WBMP, LPTaiwan Micropaq CorporationNo. 4, Wenhua Rd., Hsinchu Science Park,Hu-kou, Taiwan R.O.C.Tel: +886-3-597-9402www.tmc.com.twTW(3)PB, PL, PNMCSD, WPWD, WTAS, FTETAD, WBMP, LPBATeam Pacific CorporationElectronics Ave., FTI ComplexTaguig City 1630, PhilippinesTel: +63-2-838-5005www.teamglac.comPH(1)CNPLSDWDAS, FTETAD, WBMP, LPHSTong Hsing Electronic Industries, Ltd.55, Lane 365, Yingtao Road, Yinko,Taipei Hsien, Taiwan R.O.C.Tel: +886-2-2679-0122www.theil.comPH(1)TW(1)CNPBSD, WPWD, WTAS, FTETAD, EDWB, MPFC, UFBA, HSUnisem (M) Berhad9th Floor, UBN Tower, No. 10 Jalan P. Ramlee,50250 Kuala Lumpur, MalaysiaTel: +60-3-2072-3760www.unisemgroup.comCN(1), ID(1)MY(1), UK(1)US(1)PB, PL, PNWLSD, BPWP, WD, WTAS, FTET, BIAD, WBFC, UFMP, LPBAUnited Test & Assembly Center Ltd.5 Serangoon North Ave 5Singapore 554916Tel: +65-6481-0033www.utacgroup.comCN(3), SG(2)TH(1), TW(1)PB, PL, PNWL, MCSD, WPWD, WTAS, FTET, BIAD, WBFC, UFMP, GTLP, BAVigilant Technology Co., Ltd.Ladkrabang Industrial Estate,Export Processing Zone 3,322 Moo 4 Chalongkrung Rd.,Laplatiew, Ladkrabang,Bangkok 10520, ThailandTel: +66-2-739-6203www.vigilant-techno.comTH(1)PLSDWD, ASFT, ETAD, WBMP, LPVLSIP Technologies Inc.750 Presidential DriveRichardson, TX 75081Tel: +1-972-437-5506www.vlsip.comUS(1)PB, PL, PNPCSD, WDAS, FTETAD, EDWB, FCGT, UF, MPBA, HSWalton Advanced Engineering, Inc.No. 18, North First Road, K. E. P. Z.Kaohsiung 806, Taiwan R.O.C.Tel: +886-7-811-1330www.walton.com.twCN(1)JP(1)TW(1)PB, PLSD, WPWD, WTAS, FTET, BIAD, WBMP, LPBA20Chip Scale Review. March/April 2010 . [ChipScaleReview.com]
EconomicOutlook 2010By Sandra Winkler, Contributing Editor[slwinkler@newventureresearch.com]According to the Chinese calendar 2010 is a tiger year, and certainly,by comparison to 2009, the year will roar ahead. IC revenueis expected to grow at 18.8% and unit growth at 18% in2010, considerably better than the 8.8% decline in revenue and6.9% decline in units in 2009.What’s Hot in ICsDRAMs are anticipated to be the largest growth area for ICs with40% revenue growth in 2010. Numerous analog chips includingregulators and references, computer, communications, automotive, andindustrial applications; special purpose logic chips including consumer,computer, communications, and automotive; flash, EEPROM, 32-bitMCU, standard cell, and PLD chips will all see revenue growth rates inexcess of 15%.Why the Upturn?Low interest rates, low oil prices, and the stimulus packages thatwere instituted around the world are all contributing to a stabilizingeconomy and upturn. Purchases were less than the replacement marketin 2009, and pent up demand is pulling the market in a positive direction.Cell phones, particularly the high-end smartphones, will see highgrowth rates. Smartphones are gaining in popularity and are becominga larger piece of the cell phone pie. Anything handheld and somewhataffordable that keeps us connected to the rest of the world seems to bedoing well. New product introductions such as Apple’s iPhone andiPad are becoming hot topics, and the Blackberry by Research in Motion(RIM) has been doing well for some time.Netbook computers, with prices as low as $200 during holiday sales,and notebook computers are quite popular. Other high growth areasinclude 3D and digital TVs, DSL/cable modems, flash drives, memorycards, set top boxes, digital cameras, automotive, and an assortment ofaudio applications.The economy is stabilizing, which is easing fears of spending onconsumer goods. The housing market, which took down theeconomy by taking the credit markets down with it, is stabilizing,and the ratio of income to housing expenditure is more balancedthan it was previously. The automotive market, which is host fornumerous ICs, had fallen substantially during the downturn. Thismarket did benefit from the cash-for-clunkers program and, althoughautomotive sales fell back after the program ended, it became abooster to spending. Automotive is expected to turn up in 2010 andbeyond, particularly in places such as China. Overall, spending ishigher now than it was in the depths of 2009. And that is what ispulling this year of the tiger up and out of the sloth of 2009, and willcarry us to a more positive future.Chip Scale Review. March/April 2010 . [ChipScaleReview.com] 21
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