34<strong>Chip</strong> <strong>Scale</strong> <strong>Review</strong>. <strong>March</strong>/<strong>April</strong> <strong>2010</strong> . [<strong>Chip</strong><strong>Scale</strong><strong>Review</strong>.com]
INTERNATIONAL DIRECTORY OF WAFER-BUMPING SERVICE PROVIDERSNotes: This list was compiled from data supplied by the respective providers and is not all-inclusive as to company or service offered. Advertisers in this issue are indicatedby boldface listings. CM=Consult Manufacturer.CompanyAddressCity, State, ZipCountryPhoneFaxFounding YearNumber of EmployeesMaximum Wafer Size (mm)Bump Pitches (µm)Bumping ServicesEquipmentA=Aligners, B=Stencil Printers, C=SteppersBumping TechnologiesJ=Jetting, P=Plating, BP=Ball/loading placement,S=Sputtered, SP=Stencil printing,CP=Copper pillar, O=OtherBump AlloysSAC=SnAgCu, Au=Gold, Eu=Eutectic,LF=Pb-free, HL=High lead, LA=Low alphaWebSiteContactAdditional OfficesAdvanpack Solutions Pte Ltd54 Serangoon North Ave 4Singapore 555854Tel: +65-6482-5995CMCM50 – 150Wafer Bumping and RDLand WLP CapabilitiesCMP, S, CP, 0Au, LF, HL, Cuwww.advanpack.comAmkor Technology Inc.1900 South Price Rd.Chandler, AZ 85286Tel: 480.821.5000Fax: 480.821.827619685,000+30060 to 300150-, 200- and 300mm waferbumping/test/die processingABP, P (electroplating), SEu, LF, HL, LAwww.amkor.comASE GroupKaohsiung, Taiwan 811Tel: +886.7.361.30941984CM300CMCMCMP, SPCMwww.aseglobal.comASE (U.S.) Inc.Santa Clara, CA 95054Tel: 408-986-6500<strong>Chip</strong>Bond Technology CorporationHsinchu Science ParkHsinchu, 300 TaiwanTel: 886-3-5678788CM300CMPrototype and High Volume WaferBump processing with other Assemblyand Testing Service capabilities availableCMP, S, SP, OLF, HL, Au, Pl+Auwww.chipbond.com.twEncinitas, CA 92023Tel: 949-285-6383<strong>Chip</strong>MOSHsinchu Science ParkHsinchu, TaiwanTel: 866-3-577-0055CM200CMGold Bumping ServicesA,CSAuwww.chipmos.com<strong>Chip</strong>MOS USASan Jose, CA 95134Tel: 408-922-2777Flip<strong>Chip</strong> InternationalDiv. of Rose Street Labs3701 E. University Dr.Phoenix, AZ 85034Tel: 602.431.60201996CM20070 (R&D), 150+ (production)Flip chip and wafer bumping, Ultra CSP,Elite CSP, copper pillars, thinning, plusbackend to tape & reel or chip traysA, CSputtered UBM, electrolessNi/Au UBM, SP, BP alloys, CPCMwww.flipchip.comi2a Technologies399 West Warren AveFremont, CA 94538Tel: 510.770.03221993 (formerly IPAC)CM200 (300 soon)50µm Au stud, 180µm solder bump,400+ WLPWL-CSP and flip chip ranges, bumpedwafers, finished package (WLP andFC), die in tape & reel or waffleBSPEu, LF, SnAgCuwww.i2a-tech.comIC Interconnect1025 Elkton DrColorado Springs, CO 80907Tel: 719.533.1030199812200 B 200µm+ENi/UBM combined with stencilprinted solder, low cost wafer bumpingCMSP, BPEu, HL, electroless UBM, SACwww.icinterconnect.com<strong>Chip</strong> <strong>Scale</strong> <strong>Review</strong>. <strong>March</strong>/<strong>April</strong> <strong>2010</strong> . [<strong>Chip</strong><strong>Scale</strong><strong>Review</strong>.com] 35