March - April 2010 - Chip Scale Review

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pull, ball shear, and die shear, theCondor EZ has the capability toperform peel testing, push testing, androller testing. All of these tests can bedone on one test head that featuresfour different measurement sensors.The system can perform mechanicalshock testing by changing the testhead for impact testing or ribbon peeltesting of photovoltaic cells. Allimportant software functions can becontrolled by a single touch of a buttonto ensure simplicity. XYZTECequipment is used worldwidethroughout the semiconductor,automotive, solar and raw materialsindustries.[www.xyztec.com]Incal Introduces ‘Inspire 8160HX’ Power Burn-In SystemIncal Technology, Inc. has justintroduced its latest ‘Inspire 8160 HX’System for the power device burn-inmarket.The ‘Inspire 8160 HX’ Systemprovides individual temperature controlfor low to medium power SOC and mixedsignal devices up to 60Watts. It usesthermal sockets and the wellestablished Incal XP-160 driver andInspire system software.As thermal control andmanagement is at the DUT level, noconventional thermal chamber isrequired. Since XP-160 /Inspirecontinue to be the main systemarchitecture, all currently availableburn-in system capabilities (driveand monitoring) and features areavailable for this ‘NEW’ system,including the ‘Analog Option’. This‘Inspire 8160 HX’ System addressesthe increasing concern of powerdissipation of high-power semiconductordevices. The power consumed by highpowersemiconductor devices can varyby up to 50%, due to variation infabrication process.This causes a large variation intemperature among the samedevices in the burn-in chamber. Inorder to burn-in all devices at thesame junction temperature, there isa need for Individual ‘TemperatureControl’ per DUT. This ‘Inspire 8160HX’ system provides individualtemperature control at the DUT.Two major Independent TestLaboratories have purchased this‘system’, adding this to many Incalstandard HTOL Infinity/Inspiresystems on their floor.[www.incal.com]38Chip Scale Review. March/April 2010 . [ChipScaleReview.com]
PRODUCT SHOWCASECALENDARMay 19-21, 2010SEMICON Singapore 2010Suntec, Singaporewww.semiconsingapore.org/index.htmMay 20, 20108th Annual Meptec MEMS SymposiumSan Jose, CA, USAmeptec.org/meptec8thannualm.htmlJune 1-4, 2010Electronic Components and Technology Conference (ECTC)Las Vegas, Nevada, USAwww.ectc.net/location/2010/index.cfmJune 14-16, 2010SEMICON RussiaMoscow, Russiawww.semiconrussia.org/SCRUSSIA-EN/index.htmJuly 13-15, 2010SEMICON WestSan Francisco, California, USAsemiconwest.org/index.htmChip Scale Review. March/April 2010 . [ChipScaleReview.com] 39
Page 4 and 5: 2Chip Scale Review. March/April 201
Page 6: VOLUME 14, NUMBER 2FROM THE PUBLISH
Page 9 and 10: Chip Scale Review. March/April 2010
Page 11 and 12: well as for our customers in Asia w
Page 13 and 14: the signature of apartnership witht
Page 15 and 16: IC Assembly and Test Market Poisedf
Page 17 and 18: Honorable MentionCarsem (M) Sdn. Bh
Page 19 and 20: INTERNATIONAL DIRECTORY OF IC PACKA
Page 21 and 22: INTERNATIONAL DIRECTORY OF IC PACKA
Page 23 and 24: EconomicOutlook 2010By Sandra Winkl
Page 25 and 26: ● Fast chips must be mixed with s
Page 27 and 28: expensive “semiconductor” equip
Page 29 and 30: integration technology is far in th
Page 31 and 32: Next-Gen Advanced Packages Spell Op
Page 33 and 34: High Temperature Stack-chip, Die-at
Page 35 and 36: Figure 6. Specialty fill-in adhesiv
Page 37 and 38: INTERNATIONAL DIRECTORY OF WAFER-BU
Page 39: WHAT'S NEW!Nanoscale MEMS Made Insi

March - April 2010 - Chip Scale Review

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