March - April 2010 - Chip Scale Review

pull, ball shear, and die shear, theCondor EZ has the capability toperform peel testing, push testing, androller testing. All of these tests can bedone on one test head that featuresfour different measurement sensors.The system can perform mechanicalshock testing by changing the testhead for impact testing or ribbon peeltesting of photovoltaic cells. Allimportant software functions can becontrolled by a single touch of a buttonto ensure simplicity. XYZTECequipment is used worldwidethroughout the semiconductor,automotive, solar and raw materialsindustries.[www.xyztec.com]Incal Introduces ‘Inspire 8160HX’ Power Burn-In SystemIncal Technology, Inc. has justintroduced its latest ‘Inspire 8160 HX’System for the power device burn-inmarket.The ‘Inspire 8160 HX’ Systemprovides individual temperature controlfor low to medium power SOC and mixedsignal devices up to 60Watts. It usesthermal sockets and the wellestablished Incal XP-160 driver andInspire system software.As thermal control andmanagement is at the DUT level, noconventional thermal chamber isrequired. Since XP-160 /Inspirecontinue to be the main systemarchitecture, all currently availableburn-in system capabilities (driveand monitoring) and features areavailable for this ‘NEW’ system,including the ‘Analog Option’. This‘Inspire 8160 HX’ System addressesthe increasing concern of powerdissipation of high-power semiconductordevices. The power consumed by highpowersemiconductor devices can varyby up to 50%, due to variation infabrication process.This causes a large variation intemperature among the samedevices in the burn-in chamber. Inorder to burn-in all devices at thesame junction temperature, there isa need for Individual ‘TemperatureControl’ per DUT. This ‘Inspire 8160HX’ system provides individualtemperature control at the DUT.Two major Independent TestLaboratories have purchased this‘system’, adding this to many Incalstandard HTOL Infinity/Inspiresystems on their floor.[www.incal.com]38Chip Scale Review. March/April 2010 . [ChipScaleReview.com]