Marvell PXA27x Processor Family

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PXA27x Processor Family Design Guide 2.2.3.3 PBGA Escape Routing This section documents the method of PBGA routing along with the recommended dimensions. Table 5: PCB Dimensions for Copper-Defined Land Pads Feature 2.2.4 PCB Keep-out Zones 1.0 mm PBGA A: Land Pad Size 0.406 (0.016) B: Solder Mask Opening 0.610 (0.024) C: Typical Trace Width 0.127 (0.005) D: Reduced Trace Width Between Land Pads 0.0889 (0.0035) E: Trace Width (2 Traces) 0.090 (0.0035) F: Spaces (2 Traces) 0.090 (0.0035) G: Typical Micro Via (Via-in-Pad) Drill Size N/A NOTE: 1. All dimensions are in mm (inches). Another key PCB design element is the keep-out zone. The keep-out zone is the distance on each side of the CSP component to the nearest adjacent component on the board. This keep-out zone varies depending on the application and is generally much tighter in handheld applications that require many components in a very small PCB area. While system designers often design keep-out zones anywhere from 0.100 to 0.050 inches (2.54 mm to 1.27 mm) for embedded applications, many handheld applications are trending toward 0.025 inches (.635 mm) and smaller. The key factor to consider is how the component needs to be reworked if the component is replaced. Some Original Equipment Manufacturers (OEMs) require rework using a hot air nozzle that isolates the rework area to the specific component that is being reworked. Pay special considerations for allowing adequate area for the hot air nozzle to surround the CSP being reworked. Currently, there is no rework procedure for the FS-CSP product. Another factor that impacts the PCB keepout area requirements is the use of a socket. While sockets are only used during product development, the sockets require larger keep-out areas to accommodate mechanical mounting holes. The sockets often require backing plates that prevent the use of decoupling components under the IC package where the components are most effective. 2.2.5 Recommended Mobile Handset Dimensions For VF-BGA and FS-CSP packages with bodies >12xY mm and
Figure 10: Recommended Mobile Handset Dimensions Diagram 2.3 Power Supply Decoupling Requirements Each major power plane section or feeder trace requires a 4.7 µF or larger bulk decoupling capacitor near the processor. The processor also requires a 0.1 µF high-frequency decoupling capacitor on the bottom PCB layer under the package for each group of three to four power supply pins. 2.3.1 Thermal Considerations This subsection describes requirements to ensure the PCB provides adequate thermal dissipation to ensure compliance with the device operating temperature limitations and long-term reliability. In battery-powered handset and PDA applications, large heat sinks and forced air cooling are obviously not practical. For the PXA270 processor, the package heat dissipation is accomplished primarily using conduction from the 36 center ground balls to the PCB ground plane. For this reason, the 36 center balls of the VF-BGA package are connected to a solid ground plane under the package using at least one for every four balls to ensure adequate thermal dissipation. When the PXA27x processor IC package has a mechanical connection to the product case, this path also helps dissipate package thermal energy. Refer to Chapter 4 in the Intel ® Packaging Data Book at http://www.intel.com/design/PACKTECH/packbook.htm for more information on package thermal requirements. 2.4 Package to Board Assembly Process Refer to Chapter 14 in the Intel ® Packaging Data Book at http://www.intel.com/design/PACKTECH/packbook.htm for more information on package to board assembly considerations. Copyright © 2009 Marvell Doc. No. MV-S301207-00 Rev. A April 6, 2009, Released Page 35
Page 1 and 2: Cover Marvell ® PXA27x Processor F
Page 3 and 4: Table of Contents Section 1. Introd
Page 5 and 6: 5.5.1 Fly-By DMA Transfers ........
Page 7 and 8: 7.5.8 Active Color, 18-bit per pixe
Page 9 and 10: 15.4 Modes of Operation Overview ..
Page 11 and 12: 24.2 Signals ......................
Page 13 and 14: Appendix E. Companion Components fo
Page 15 and 16: List of Figures Figure 1: PXA27x Pr
Page 17 and 18: Figure 83: TAP Controller State Dia
Page 19 and 20: Table 40: FFUART Interface Signals.
Page 21 and 22: Section 1. Introduction to Part I T
Page 23 and 24: 1.3 Package Introduction The PXA27x
Page 25 and 26: Section 2. PCB Design Guidelines Th
Page 27 and 28: Figure 3: Recommended PCB Layer Ass
Page 29 and 30: Figure 5: VF-BGA 13mm x 13mm Compon
Page 31 and 32: Figure 7: PBGA 23mm x 23mm Componen
Page 33: 2.2.3.2 FS-CSP Escape Routing This
Page 37 and 38: Figure 11: FS-CSP (14x14) Tray Spec
Page 39 and 40: Section 3. Design Check List For de
Page 41 and 42: Section 4. Mixed Voltage Design Con
Page 43 and 44: Figure 13: Minimal Voltage Regulato
Page 45 and 46: Section 5. Power Measurements 5.1 O
Page 47 and 48: • Ensure TDI and TMS pins are pul
Page 49 and 50: Section 1. Introduction to Part II
Page 51 and 52: Section 2. Package and Pins Refer t
Page 53 and 54: Section 3. Clocks and Power Interfa
Page 55 and 56: 3.2.3 Power Enable (PWR_EN) PWR_EN
Page 57 and 58: Figure 14: Typical Battery and Exte
Page 59 and 60: Note The oscillator-output-high-dri
Page 61 and 62: Section 4. Internal SRAM There is n
Page 63 and 64: Section 5. DMA Controller Interface
Page 65 and 66: 5.5.1.1 Signals See Table 10 for th
Page 67 and 68: Figure 18: Companion Chip Requestin
Page 69 and 70: Section 6. System Memory Interface
Page 71 and 72: Table 13: PXA27x Processor Memory C
Page 73 and 74: Figure 18: General Memory Interface
Page 75 and 76: Figure 19: PXA27x Processor Memory
Page 77 and 78: 6.5 Modes of Operation Overview Ref
Page 79 and 80: Figure 22: SDRAM Memory System Exam
Page 81 and 82: Table 18: Device 1 x 12 x 8 BS0 A11
Page 83 and 84: Table 20: Signal Name Flash Interfa
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6.5.3 ROM Interface 6.5.3.1 ROM Sig
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Table 22: Signal Name SRAM Interfac
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6.5.5 Variable Latency Input/Output
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6.5.5.3 VLIO Memory Layout Notes Re
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Refer to Marvell ® PXA270 Processo
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Figure 28: External Logic for a Two
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esponsibility for SDRAM integrity d
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Figure 29: Alternate Bus Master Mod
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Section 7. LCD Interface This chapt
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Table 27: LCD Controller Data Pin U
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7.5 Modes of Operation Overview 7.5
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Table 29: Passive Display Pins Requ
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Table 33: LCD Interface Signal List
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7.5.7.1 Signals The signals in Tabl
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7.5.8.1 Signals The signals in Tabl
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7.5.9.1 Signals For active displays
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Section 8. SSP Port Interface 8.1 O
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Table 37: SSP Serial Port I/O Signa
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Figure 41: External Clock Enable Co
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Section 9. Inter-Integrated Circuit
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. Figure 44: Using an Analog Switch
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Section 10.UART Interfaces This cha
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Table 39: UART Signal Descriptions
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10.3.2 Bluetooth UART The BTUART is
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Section 11. Fast Infrared Interface
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Section 12.USB Client Controller Th
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• A more inexpensive solution is
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• During sleep and deep sleep mod
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Figure 54: Host Port 2 OTG Transcei
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• UDC • D+, D-, and transmit en
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Figure 57: Connection to OTG ID USB
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Table 47: Input from External USB T
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Section 13.AC ’97 This chapter de
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5. Enter sleep mode as outlined in
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Section 14.I 2 S Interface This cha
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Figure 60: I 2 S Controller Interfa
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Figure 61: PXA27x Processor Provide
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Section 15.MultiMediaCard/SD/SDIO C
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Table 54: MMC/SD/SDIO Controller Su
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See Figure 64 for the detailed sche
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Figure 65: SD and SDIO Protocol Int
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Table 58: SD/SDIO Card Pull-Up and
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See Figure 66 for illustration of a
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Section 16.Baseband Interface 16.1
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Section 17.Keypad Interface This ch
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17.4 Layout Notes This section has
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Figure 69: Keypad Matrix and Direct
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17.5.3 Keypad Matrix and Direct Key
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Section 18.USIM Controller Interfac
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18.2.2 USIM Card Interface Signals
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Figure 73: Connectivity USIM Card a
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Section 19.Universal Serial Bus Hos
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Figure 75: PXA27x Processor Host 2
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Section 20.Real Time Clock Interfac
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Section 21.OS Timer Interface This
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21.3.4 Output Control This block co
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Section 22.Pulse-Width Modulator In
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Section 23.General Purpose Input/Ou
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causes extraneous resets or interru
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Section 24.Interrupt Interface This
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Figure 80: Interrupt Controller Blo
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Section 25.JTAG Debug This chapter
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Table 69: TAP Controller Pin Defini
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Figure 82: PXA27x Processor Scan Ch
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Table 71: IEEE 1149.1 Boundary-Scan
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25.4.4.3 Data-Specific Registers Da
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25.4.5.3 Select-DR-Scan State The S
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25.4.5.14Pause-IR State The Pause-I
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Section 26.Quick Capture Interface
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Figure 85: Interface Options Summar
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Appendix A. PXA27x DVK Block Diagra
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Figure 87: Main Board Block Diagram
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Figure 89: Liquid Crystal Display B
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Figure 91: Keyboard Block Diagram F
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Appendix B. PXA27x Processor Develo
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Appendix C. PXA27x DVK Bill-of-Mate
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Appendix D. PXA27x Processor and PX
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DSADR16 - DSADR31 DTADR16 - DTADR31
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- FBR1-FBR6 registers added to supp
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• An optional output AC97_SYSCLK
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- The RTSR register has 12 new alar
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Note The only register that remains
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Appendix E. Companion Components fo
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E.6 Memory Controller E.7 LCD Contr
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E.13 AC ‘97 E.14 I 2 S (Inter IC
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Glossary 3G. An industry term used
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Circuit Switched. Used by wireless
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Endpoint Direction. The direction o
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HSTL. High-Speed Transceiver Logic
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inter-symbol interference, because
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SAW. Surface Acoustic Wave filter.
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TPV. Third Party Vendor Transaction
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Back Cover Marvell Semiconductor, I
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