Marvell PXA27x Processor Family

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PXA27x Processor Family Design Guide 4.3 Cautions Observe the following cautions for proper operation and reliability of the PXA27x processor: • All power domains are equal to or lower than VCC_IO (excluding VCC_USB). • The application of VCC_BATT to the PXA27x processor from a state where there was no voltage applied to VCC_BATT is referred to as start-of-date. If only VCC_BATT is applied at the start-of-date, the current internal state of the PXA27x processor causes the current draw to be higher than when the PXA27x processor is in deep sleep mode. Such a situation is undesirable for systems that are production units, therefore, do not use these units immediately. After the backup battery is initially installed, if the devices are not brought into at least deep sleep mode through software, the backup battery experiences drainage. To avoid drainage of backup battery and to allow the backup battery to remain connected after production, boot the device and then place the device in deep sleep mode. Doc. No. MV-S301207-00 Rev. A Page 44 Copyright © 2009 Marvell April 6, 2009, Released
Section 5. Power Measurements 5.1 Overview The PXA27x processor employs a complex power management system that provides the best possible power utilization. Take additional steps to minimize total power consumption. This chapter describes recommended methods for measuring power and provides the recommended steps in detail to minimize overall power usage. 5.2 Measurement Guidelines There are two methods for measuring power on each of the power domains of the PXA27x processor: • Measuring voltage across a series resistor • Measure current directly with a current meter in series The development design must allow for each power domain of the PXA27x processor to receive power independently through a dedicated shunt jumper followed by a shunt resistor for each power domain to use the two recommended methods. No matter what method is used, measure the voltage at the PXA27x processor and monitor the voltage across all power domains during each measurement. 5.2.1 Measure Voltage Across a Series Resistor This method measures voltage across a series resistor and calculates the total power consumed. This method involves using equipment to measure a voltage across a known series resistance and calculating the current works for calculating power during normal mode operations. This method is preferred for high current power supplies such as VCC_CORE. However, this method is not ideal for measuring low power due to the limitations of the equipment being used to measure power. The voltage drop when measuring low power could be too small for detection by the digital volt meter (DVM). 5.2.2 Measure Current Directly with a Current Meter in Series This method measures current directly with a current meter in series, then calculates total power consumed. This methods works for all power modes, but could be too invasive and negatively affect the functioning of the PXA27x processor in some cases. Use the following procedure to measure current directly with a current meter is series: 1. Check the internal resistance for the current meter. 2. Calculate the effective voltage drop across the internal resistance based of the maximum expected current. 3. Verify that the voltage drop minus the voltage supplying the voltage domain being tested does not fall below the required V in for that domain. Some DVMs have an internal resistance of 1.0 to 2.0 Ω that could cause the V in to drop below the minimum required supply voltage depending on the power mode being used. If V in drops below the minimum required supply voltage, the external power supply would be required to compensate. The method of measuring current directly with a current meter in series is preferred for low current. Use the lowest possible range supported by the DVM. Avoid changing ranges during the operation of PXA27x processor. Copyright © 2009 Marvell Doc. No. MV-S301207-00 Rev. A April 6, 2009, Released Page 45
Page 1 and 2: Cover Marvell ® PXA27x Processor F
Page 3 and 4: Table of Contents Section 1. Introd
Page 5 and 6: 5.5.1 Fly-By DMA Transfers ........
Page 7 and 8: 7.5.8 Active Color, 18-bit per pixe
Page 9 and 10: 15.4 Modes of Operation Overview ..
Page 11 and 12: 24.2 Signals ......................
Page 13 and 14: Appendix E. Companion Components fo
Page 15 and 16: List of Figures Figure 1: PXA27x Pr
Page 17 and 18: Figure 83: TAP Controller State Dia
Page 19 and 20: Table 40: FFUART Interface Signals.
Page 21 and 22: Section 1. Introduction to Part I T
Page 23 and 24: 1.3 Package Introduction The PXA27x
Page 25 and 26: Section 2. PCB Design Guidelines Th
Page 27 and 28: Figure 3: Recommended PCB Layer Ass
Page 29 and 30: Figure 5: VF-BGA 13mm x 13mm Compon
Page 31 and 32: Figure 7: PBGA 23mm x 23mm Componen
Page 33 and 34: 2.2.3.2 FS-CSP Escape Routing This
Page 35 and 36: Figure 10: Recommended Mobile Hands
Page 37 and 38: Figure 11: FS-CSP (14x14) Tray Spec
Page 39 and 40: Section 3. Design Check List For de
Page 41 and 42: Section 4. Mixed Voltage Design Con
Page 43: Figure 13: Minimal Voltage Regulato
Page 47 and 48: • Ensure TDI and TMS pins are pul
Page 49 and 50: Section 1. Introduction to Part II
Page 51 and 52: Section 2. Package and Pins Refer t
Page 53 and 54: Section 3. Clocks and Power Interfa
Page 55 and 56: 3.2.3 Power Enable (PWR_EN) PWR_EN
Page 57 and 58: Figure 14: Typical Battery and Exte
Page 59 and 60: Note The oscillator-output-high-dri
Page 61 and 62: Section 4. Internal SRAM There is n
Page 63 and 64: Section 5. DMA Controller Interface
Page 65 and 66: 5.5.1.1 Signals See Table 10 for th
Page 67 and 68: Figure 18: Companion Chip Requestin
Page 69 and 70: Section 6. System Memory Interface
Page 71 and 72: Table 13: PXA27x Processor Memory C
Page 73 and 74: Figure 18: General Memory Interface
Page 75 and 76: Figure 19: PXA27x Processor Memory
Page 77 and 78: 6.5 Modes of Operation Overview Ref
Page 79 and 80: Figure 22: SDRAM Memory System Exam
Page 81 and 82: Table 18: Device 1 x 12 x 8 BS0 A11
Page 83 and 84: Table 20: Signal Name Flash Interfa
Page 85 and 86: 6.5.3 ROM Interface 6.5.3.1 ROM Sig
Page 87 and 88: Table 22: Signal Name SRAM Interfac
Page 89 and 90: 6.5.5 Variable Latency Input/Output
Page 91 and 92: 6.5.5.3 VLIO Memory Layout Notes Re
Page 93 and 94: Refer to Marvell ® PXA270 Processo
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Figure 28: External Logic for a Two
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esponsibility for SDRAM integrity d
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Figure 29: Alternate Bus Master Mod
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Section 7. LCD Interface This chapt
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Table 27: LCD Controller Data Pin U
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7.5 Modes of Operation Overview 7.5
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Table 29: Passive Display Pins Requ
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Table 33: LCD Interface Signal List
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7.5.7.1 Signals The signals in Tabl
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7.5.8.1 Signals The signals in Tabl
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7.5.9.1 Signals For active displays
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Section 8. SSP Port Interface 8.1 O
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Table 37: SSP Serial Port I/O Signa
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Figure 41: External Clock Enable Co
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Section 9. Inter-Integrated Circuit
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. Figure 44: Using an Analog Switch
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Section 10.UART Interfaces This cha
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Table 39: UART Signal Descriptions
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10.3.2 Bluetooth UART The BTUART is
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Section 11. Fast Infrared Interface
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Section 12.USB Client Controller Th
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• A more inexpensive solution is
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• During sleep and deep sleep mod
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Figure 54: Host Port 2 OTG Transcei
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• UDC • D+, D-, and transmit en
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Figure 57: Connection to OTG ID USB
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Table 47: Input from External USB T
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Section 13.AC ’97 This chapter de
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5. Enter sleep mode as outlined in
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Section 14.I 2 S Interface This cha
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Figure 60: I 2 S Controller Interfa
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Figure 61: PXA27x Processor Provide
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Section 15.MultiMediaCard/SD/SDIO C
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Table 54: MMC/SD/SDIO Controller Su
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See Figure 64 for the detailed sche
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Figure 65: SD and SDIO Protocol Int
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Table 58: SD/SDIO Card Pull-Up and
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See Figure 66 for illustration of a
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Section 16.Baseband Interface 16.1
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Section 17.Keypad Interface This ch
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17.4 Layout Notes This section has
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Figure 69: Keypad Matrix and Direct
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17.5.3 Keypad Matrix and Direct Key
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Section 18.USIM Controller Interfac
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18.2.2 USIM Card Interface Signals
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Figure 73: Connectivity USIM Card a
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Section 19.Universal Serial Bus Hos
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Figure 75: PXA27x Processor Host 2
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Section 20.Real Time Clock Interfac
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Section 21.OS Timer Interface This
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21.3.4 Output Control This block co
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Section 22.Pulse-Width Modulator In
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Section 23.General Purpose Input/Ou
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causes extraneous resets or interru
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Section 24.Interrupt Interface This
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Figure 80: Interrupt Controller Blo
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Section 25.JTAG Debug This chapter
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Table 69: TAP Controller Pin Defini
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Figure 82: PXA27x Processor Scan Ch
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Table 71: IEEE 1149.1 Boundary-Scan
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25.4.4.3 Data-Specific Registers Da
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25.4.5.3 Select-DR-Scan State The S
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25.4.5.14Pause-IR State The Pause-I
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Section 26.Quick Capture Interface
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Figure 85: Interface Options Summar
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Appendix A. PXA27x DVK Block Diagra
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Figure 87: Main Board Block Diagram
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Figure 89: Liquid Crystal Display B
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Figure 91: Keyboard Block Diagram F
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Appendix B. PXA27x Processor Develo
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Appendix C. PXA27x DVK Bill-of-Mate
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Appendix D. PXA27x Processor and PX
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DSADR16 - DSADR31 DTADR16 - DTADR31
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- FBR1-FBR6 registers added to supp
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• An optional output AC97_SYSCLK
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- The RTSR register has 12 new alar
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Note The only register that remains
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Appendix E. Companion Components fo
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E.6 Memory Controller E.7 LCD Contr
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E.13 AC ‘97 E.14 I 2 S (Inter IC
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Glossary 3G. An industry term used
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Circuit Switched. Used by wireless
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Endpoint Direction. The direction o
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HSTL. High-Speed Transceiver Logic
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inter-symbol interference, because
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SAW. Surface Acoustic Wave filter.
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TPV. Third Party Vendor Transaction
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Back Cover Marvell Semiconductor, I
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Marvell PXA27x Processor Family

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