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FLEX CIRCUITS DESIGN GUIDE

Minco Flex Circuits Design Guide - BiS Sistem

Minco Flex Circuits Design Guide - BiS Sistem

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Design Guidelines<br />

Manufacturing a flex circuit<br />

Building a flex circuit generally involves the same steps from circuit to circuit. However, certain circuit designs can add cost. For example,<br />

a single-layer circuit with access holes on both sides is more expensive than a single-layer circuit with access on one side, because<br />

the double-sided access hole circuit must have its substrate drilled separately. The flow chart and illustrations below identify some cost<br />

driven issues, such as access holes, plated through-holes, etc. The<br />

flow chart shows the manufacturing process for a standard<br />

double-layer circuit with a stiffener.<br />

Base<br />

Material<br />

Drill<br />

Plate Print Etch<br />

Copper<br />

Top<br />

Cover<br />

Drill<br />

Copper<br />

Polyimide<br />

Substrate<br />

Adhesive<br />

Plated<br />

Copper<br />

Bottom<br />

Cover<br />

Drill<br />

1. Double-sided material is drilled 2. Through-holes are copper-plated<br />

Adhesive<br />

Laminate<br />

Conductor<br />

FR-4<br />

Material<br />

Tack<br />

Drill<br />

Solder<br />

Pad<br />

3. Copper is etched to create<br />

conductors and pads<br />

Access Hole<br />

4. Polyimide covers are laminated<br />

over etched copper<br />

Ship<br />

Inspect<br />

Laminate<br />

Blank<br />

Cost impact of layer count<br />

The information for the chart (right) was taken from a sample of<br />

circuits built with Minco’s standard materials. This chart is not<br />

intended to be used as a price guide. However, it does show<br />

that circuit cost generally rises with layer count.<br />

It is in your best interest to consider all options to minimize<br />

cost. For example, use two circuits to do the job of one. Two<br />

double-layer circuits may be less expensive than one four-layer<br />

circuit. But the cost savings of the circuit may be offset by additional<br />

assembly requirements. Circuits can also be folded in<br />

order to save space and layers. Each situation is unique. A relatively<br />

small amount of time invested in project assessment can<br />

result in significant savings overall.<br />

COST MULTIPLIER<br />

6<br />

5<br />

4<br />

3<br />

2<br />

1<br />

0<br />

1-Layer<br />

Access<br />

1-Side<br />

1-Layer<br />

Access<br />

2-Sides<br />

2-Layer<br />

3-Layer<br />

Multi-Layer<br />

CIRCUIT TYPE<br />

4-Layer<br />

Multi-Layer<br />

4-Layer<br />

Rigid-Flex<br />

7

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