Buku Panduan Prasiswazah Sesi Akademik 2015-2016

Fakulti Kejuruteraan dan Alam Bina 241
The aims of this course are to provide knowledge and comprehension on the
fabrication processes of semiconductor devices and integrated circuits. Topics
covered are cleanroom facility, photolitography, etching, oxidation, diffusion,
ion-implantation, thin-film deposition, metallization, interconnects, and IC
packaging.
Pra-Keperluan (jika ada):
KKKT3253 Mikroelektronik
Pre-Requisite (if any):
KKKT3253 Microelectronics
Bacaan Asas:
References:
Gyu-Chul Yi, 2014, Fsemiconductor nanostructures for Optoelectronic Devices,
Springer.
Peter Van Zant, 2014, Microchip Fabrication: A Practical Guide to Semiconductor
Processing, 6th edition, McGraw Hill.
Stephen A. Campbell, 2012, Fabrication Engineering at the Micro- and
Nanoscale, Oxford University Press.
L. Monch, J. W. Fowler, S. Mason, 2013, Fproduction Planning and Control for
Semiconductor Wafer Facilities: Modeling, Analysis and Systems, Springer.
Richard C. Jaeger, 2002, Introduction to Microelectronic Fabrication, Prentice
Hall.
Hasil Pembelajaran
Course Outcomes
Bil
No.
1
2
Hasil Pembelajaran Kursus
Course Outcomes (CO)
Berkebolehan menerangkan ciri-ciri bahan semikondukor dan kepentingannya dalam proses
fabrikasi; konsep bilik-bersih; pencemaran dan kontaminasi; aspek keselamatan dan protokol.
Ability to explain the characteristics of semiconductor materials and its importance in fabrication
processes; cleanroom facility; pollution and contaminant; safety aspect and protocol.
Berkebolehan menghubungkaitkan proses-proses fabrikasi; dan mengenal pasti dan menilai proses/
peralatan yang sesuai bagi fabrikasi peranti semikonduktor.
Ability to inter-relate the fabrication processes; and to identify and evaluate suitable processes/
instruments for the fabrication of semiconductor devices.