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Literaturverzeichnis [1] MYŚLIWIEC, M. und R. KISIEL. Die attachment Process Overview for High Power Semiconductors. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE): IEEE, 2023, S. 1-5. ISBN 979-8-3503-3484-5 [2] SYED-KHAJA, A. Diffusion Soldering for High-temperature Packaging of Power Electronics [online]. Verfügbar unter: doi:10.25593/978-3-96147-163-8 [3] OTTINGER, B., J. HOLVERSCHEID, S. KONIG, E. JERICHOW, S. LUNZ, M. SPRENGER, L. MUL- LER, C. GOTH und J. FRANKE. Reliability of lead-free solders for die attach in automotive power modules. In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC): IEEE, 2022, S. 409-413. ISBN 979-8-3503-9885-4 [4] OCKEL, M., A. HENSEL, S. STEGMEIER und J. FRANKE. Plasma Powder Copper Coating on silicon substrates for copper wire bonds in comparison to state-of-the-art top-side interconnection technologies. In: Pan Pacific Microelectronics Symposium 2023 [5] HENSEL, A., M. MUELLER, J. FRANKE und K.K. von PLATEN. Additive Copper Metallization of Semiconductors for Enabling a Copper Wire Bonding Process. In: 40th International Spring Seminar 2017, S. 1-6 [6] BRAUN, T., S. GREINER, J. FRANKE und D. DRUMMER. Additive Plasma Metallization of Spatial Ceramic Injection Molded Components. In: 12th International Congress Molded Interconnect Devices. Scientific Proceedings, 2016, S. 62-67. ISBN 978-1-5090-5427-5 [7] FAUCHAIS, P.L., J.V. HEBERLEIN und M.I. BOULOS. Thermal Spray Fundamentals. Boston, MA: Springer US, 2014. ISBN 978-0-387-28319-7 [8] SUDHARSHAN PHANI, P., D. SRINIVASA RAO, S.V. JOSHI und G. SUNDARARAJAN. Effect of Process Parameters and Heat Treatments on Properties of Cold Sprayed Copper Coatings [online]. Journal of Thermal Spray Technology, 2007, 16(3), S. 425-434. ISSN 1059-9630. Verfügbar unter: doi:10.1007/s11666-007-9048-1 [9] HENSEL, A., M. MÜLLER, K. KOHLMANN VON PLATEN und J. FRANKE. Additive Copper Metallization of Semiconductors for Enabling a Copper Wire Bonding Process. In: 2017 40th International Spring Seminar on Electronics Technology (ISSE). 10-14 May 2017. Piscataway, NJ: IEEE, 2017. ISBN 978-1-5386-0582-0 [10] OCKEL, M., F. FUNK, L. JANISCH und J. FRANKE. Evaluation of the Cold Atmospheric Plasma Metallization of Bare Dies with Copper Through Life Cycle Assessment. In: WGP-Kongress 2023, S. 417-427 26 <strong>DVS</strong> 393
Comparative Studies of SUS316L Layer Deposited by Conventional Laser Cladding and Extreme High Speed Laser Cladding T. Izumi(Hyogo, Japan), A. Yano(Hyogo, Japan), and M. Arai(Tokyo, Japan) Extreme High -Speed Laser Cladding (EHLA) is a new process category of laser cladding. In this study, EH- LA layer was characterized by comparing with conventional laser cladding (LC) layer. Basic SUS316L layers, as well as WC-reinforced SUS316L layers, were formed on SUS304 substrates using both LC and EHLA processes. The macroscopic morphology, microstructure, microhardness, wear resistance, and residual stress of the four types of layers were evaluated. As a result, EHLA layers exhibited slightly higher microhardness and less wear loss than that of LC layers, despite the presence of more micropores. This can be due to their finer dendritic structures. Furthermore, residual stress of EHLA layer was lower than that of LC layer due to those micropores. Additionally, EHLA can add up to 45 wt.% WC into SUS316L layer without crack formation, resulting in higher wear resistance than that of LC where crack formation occurred at 25 wt.% WC. This enhanced crack resistance in EHLA is believed to be due to the less heat input during deposition. 1 Introduction Extreme High-Speed Laser Cladding (EHLA) has been proposed as a new process with high deposition efficiency [1]. Figure 1 shows a schematic diagram of the principles of conventional Laser Cladding (LC) and the EHLA process. EHLA enables high-speed deposition by reducing the laser spot size to approximately 1 mm in diameter, thus increasing energy density. Powders are also focused on this small spot and melted before reaching the substrate surface. Simultaneously, the residual laser energy creates a shallow melt pool on the substrate surface, enhancing metallurgical bonding. EHLA operates at a velocity of 15–200 m/min and a deposition efficiency of 0.3–3.2 m²/h, which is 10–100 times greater than that of LC. This high-speed process significantly reduces heat input to the substrate, thereby minimizing thermal distortion and dilution. These technical advantages position EHLA as a promising technology for surface treatment applications across various industrial fields. However, there is limited research investigating the characteristics of EHLA layers due to its relatively recent introduction, necessitating in-depth investigation. In particular, there are even fewer reports on EHLA layers reinforced with carbide ceramic powders which are often used to improve the wear resistance and hardness of the deposition layer [2]. In this study, EHLA layers were characterized in comparison with LC layers. The basic SUS316L layers, as well as WC-reinforced SUS316L layers, were formed on SUS304 substrates using both LC and EHLA processes. The macroscopic morphology, microstructure, microhardness, wear resistance, and residual stress of the four types of layers were evaluated. 2 Experimental procedures A 10kW diode laser coupled with a conventional lathe and a precision six-axis robot was used to both the EHLA and LC processes. SUS316L powders were deposited on a SUS304 cylinder whose dimensions are φ30 × 200 mm. The chemical composition of the powders for LC and EHLA was almost the same, but the range of particle sizes was different. The powder diameters for LC and EHLA were 53-150 µm and 20-53 µm, respectively. <strong>DVS</strong> 393 27
Page 1 and 2: 2024 PROCEEDINGS ITSC 2024 Internat
Page 5 and 6: ITSC 2024 International Thermal Spr
Page 7 and 8: Preface ITSC 2024: ADVANCING THERMA
Page 11 and 12: Table of contents Preface Time Sche
Page 13 and 14: COAXquattro: A Versatile High-Power
Page 15 and 16: Hot corrosion behaviour of yttria s
Page 17 and 18: Metals Processing Optimization of t
Page 19 and 20: Studies of Particle Deformation and
Page 21 and 22: Applications - Automotive Industry
Page 23 and 24: Development of Dense and Low Oxide
Page 25 and 26: 2.3 Coating Analysis The coated sub
Page 27 and 28: in Figure 5, is comparably low whic
Page 29 and 30: 7 Literature [BHB+23] [GAG+14] [LFM
Page 31 and 32: that using sinter-crushed La0.8Sr0.
Page 33 and 34: (a) (b) Figure 2. Morphologies of (
Page 35 and 36: The XRD patterns of APS-sprayed NZS
Page 37 and 38: 4 Conclusions The NZSP electrolytes
Page 39 and 40: Cold Atmospheric Plasma Metallizati
Page 41 and 42: Figure 2. SEM (a-c) and EDX (d) ana
Page 43 and 44: Figure 5. Setup of Plasma Coating U
Page 45 and 46: Figure 9. Metallographic cross-sect
Page 47: Figure 12. Metallographic cross-sec

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