Mixed-Signal IC Design Kit Training Manual - Electrical & Computer ...

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Cadence Abstract Generator Flow Entering Technology Information Opening a Library Importing Data Distributing Cells Generating Abstracts Verify Export LEF Supply Information about process technology from an existing tech.dpux file, by mapping GDSII files, or by importing LEF or DFII. Set the location where your cell views are stored. Import layout (Stream GDSII or DEF) and/or logical data (Verilog or TLF). Partition library cells into mutually exclusive sets for processing. Run the three abstract generation steps – Pins, Extract, and Abstract. Run checks to detect any problems in the abstracts generated. Generate LEF descriptions of the abstracts generated. 108 Mixed-Signal IC Design Kit
Entering Technology Information • Technology information provides details of the process technology to be used during IC fabrication, including names of layers, colors, and fill patterns; GDSII layer mapping data; and design rules for different layers and vias. LEF GDSII DFII Technology File Editor tech.dpux 109 Mixed-Signal IC Design Kit
Page 2 and 3:
Day 1 Introduction of Mixed-Signal
Page 4 and 5:
SoC IP Based Design CORE Zone 4: Gl
Page 7 and 8:
Sensor Analog chip Sensor Integrati
Page 9 and 10:
Challenge of Integration • High d
Page 11 and 12:
Conventional Design Concept for Blo
Page 13:
Digital Model Abstraction Digital m
Page 16 and 17:
Enabling the Top-Down Design • Be
Page 18 and 19:
Top-Down Design Methodology Top-Dow
Page 20 and 21:
What Can’t Be Expected with Mixed
Page 22 and 23:
Digital Abstraction Mixed-Signal Si
Page 24 and 25:
Basics of Mixed Signal Simulation
Page 26 and 27:
Core Modification Glued Mixed-Signa
Page 29 and 30:
The Cadence environment can be invo
Page 31 and 32:
Verimix Mixed-Signal Tool Environme
Page 33 and 34:
Before the Design Creation • Syst
Page 35 and 36:
Device / Analog leaf cell The block
Page 37 and 38:
Partition Requirement • The desig
Page 39 and 40:
Interface Elements • Generated au
Page 41 and 42:
Analog Modeling for Mixed Signal De
Page 43 and 44:
Analog Hardware Description Languag
Page 45 and 46:
Disciplines Electrical magnetic the
Page 47 and 48:
Analog Modeling Issues • The Anal
Page 49 and 50:
MS HDL Simulation Flow 49 Mixed-Sig
Page 51 and 52:
Creating the HDL View of Designed B
Page 53 and 54:
Creating Analog Block and Symbol Cr
Page 55 and 56:
Integrating the whole design within
Page 57 and 58: Schematics in Verilog-A Modules 57
Page 59 and 60: Modelwrtier: the utility for creati
Page 61 and 62: Digital Stimuli Analog Stimuli Addi
Page 63 and 64: 1. Create a behavioral view for the
Page 65 and 66: Create Config View for Simulation T
Page 67: After Setting Configuration The Hie
Page 70: The default value can be preset in
Page 73 and 74: Change View Selection With Hierarch
Page 76 and 77: Specify Simulation Environment Use
Page 78 and 79: Choosing Simulator/Directory/Host T
Page 80 and 81: Level 1 Digital to Analog Interface
Page 82 and 83: Level 3 Digital to Analog interface
Page 84 and 85: Modification of IE Parameters • T
Page 87 and 88: Some of the parameter values might
Page 89 and 90: Define the signals to plotted after
Page 91 and 92: module CCADCtop; supply1 N2; supply
Page 93 and 94: Simulation Options for Digital Simu
Page 95 and 96: Run Log Files Message for digital s
Page 97 and 98: • After Simulation, the selected
Page 99 and 100: Invoke by Tool Parametric Analysis
Page 101 and 102: Feature of HDL debug • Set breakp
Page 103 and 104: Analog blocks Digital domain Layout
Page 105 and 106: • Definition: Prepare Data for SE
Page 107: Cadence Abstract Generator • Cade
Page 111 and 112: • After you specify technology in
Page 113 and 114: • Pins: - The Abstract Generator
Page 115 and 116: • Verify: Verify - During the ver
Page 117 and 118: • LEF file • Verilog file • C
Page 119 and 120: Verilog File of TSMC .35um 2P4M •
Page 122 and 123: • LEF file • Verilog file • C
Page 124 and 125: environment.gcf GCF File (gcf (head
Page 126 and 127: … Header( Library("IMatrix8x8") D
Page 128 and 129: CTLF File of TSMC .35um 2P4M • Di
Page 130 and 131: Place IO Constraints Create placeIO
Page 132 and 133: Import LEF File • Before creating
Page 134 and 135: Import Verilog File • CIC provide
Page 136 and 137: Place Analog Block • Select the b
Page 138 and 139: Add PRDIODE • To support a separa
Page 140 and 141: Placement • Place -> Cells • Qp
Page 142 and 143: Use Ultra Router • The ultra rout
Page 144 and 145: Prepare for Layout Verification •
Page 146 and 147: Modify Layout • As the layout of
Page 148 and 149: Calibre DRC Flow • Edit the Calib
Page 150 and 151: Calibre LVS Flow (Cont.) • Add an
Page 152 and 153: Mixed Signal Parasitic Simulation
Page 154 and 155: Transistor Level Post-Layout Simula
Page 156 and 157: Timemill Input Stimulus File • Cr
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