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52 procedure, it was determined that the necessary exposure time for a photoresist thickness on the order of 1 |im was 15 seconds and 8 seconds for a thickness on the order of 0.6 urn. After exposure, the samples were immersed in Shipley 352 developer for one minute. They were then immersed in Dl water for another minute and then blow dried with nitrogen gas. A hard bake followed at 110° C for thirty minutes. Figure 4-3 presents a summary of the fabrication steps thus far. 4.5 Reactive Ion Etching Reactive ion etching (RIE), also known as ion assisted chemical etching or plasma enhanced etching, is the last step in the fabrication cycle. In RIE, a plasma is created by exciting a gas via a high frequency RF discharge. The plasma generates an active species that diffuses to the substrate and reacts with it to form volatile products. 48 The plasma also supplies energetic radiation to bombard the substrate surface. 49 Thus etching occurs due to both chemical processes and physical bombardment. The gas chosen for use in RIE is dependent on the substrate material. The gas chosen must react more strongly with and etch the substrate faster than it does the photoresist acting as the etch mask. The substrates used in this experiment were ordinary microscope slides made of soda lime glass. Etching was attempted using the parameters given in Table 4-2. 60 Etching of the substrate was not achieved using either set of parameters. In fact, polymerization or deposition was observed instead.
53 A. Substrate Preparation: 1. Soak slides in Dl water and 15 drops Micro for 5 minutes. 2. Scrub lightly while wearing gloves. 3. Sonic clean in fresh Dl water and Micro for 4 minutes. 4. Rinse thoroughly with Dl water. 5. Sonic clean in 100% ethanol for 4 minutes. 6. Drain and bake in a vented oven at 180° C for one hour. 7. Cool to ambient. B. Photoresist Deposition: 1. Place 2 drops of primer on substrate. Let stand for 10 seconds. Spin dry at 4000 rpm for 30 seconds. 2. Place 4 of drops photoresist on substrate, immediately spin for 30 seconds at appropriate speed for desired thickness. 3. Bake at 90° C for 30 minutes. 4. Cool to ambient. Place substrates in dark box. C. Exposure and Development: 1. Deep UV exposure of substrate. 2. Immerse in developer at 21° C for 60 seconds. 3. Immerse in Dl water for 60 seconds. 4. Blow Dry with N 2. 5. Hard bake at 110° C for 30 minutes. Figure 4-3 Procedures for substrate preparation and development.
Page 1:
INFORMATION TO USERS This manuscrip
Page 5 and 6: DIFFRACTIVE MICROLENSES FOR FIBER O
Page 7 and 8: ACKNOWLEDGEMENTS 3 I would like to
Page 9 and 10: 5 Page 4.3 Photoresist Deposition 4
Page 11 and 12: 7 Page 4-2 Exposure test results fr
Page 13 and 14: ABSTRACT 9 The design, fabrication,
Page 15 and 16: 11 architectures. 3,4 5 8 In all of
Page 17 and 18: 13 microlenses have been presented
Page 19 and 20: 15 element acts as an interface bet
Page 21 and 22: CHAPTER 2 17 LENS PARAMETERS FOR FI
Page 23 and 24: 19 power coupling efficiency, T, be
Page 25 and 26: lens is, 21 NAflber = ^=m^. R R . 2
Page 27 and 28: 2.3 Chromatic Aberration 23 Despite
Page 29 and 30: 25 JL 0.985 0.99 0.995 .005 .015 >r
Page 31 and 32: 27 Propagation Distance (mm) Figure
Page 33 and 34: 29 spherical wave emitted from a po
Page 35 and 36: 31 zones is used, the light from ev
Page 37 and 38: 33 OPD=Jrl+f 2 3 3 The incident pla
Page 39 and 40: 3.3 Multi-level Diffractive Lenses
Page 41 and 42: 37 four level approximation. As the
Page 43 and 44: 39 a) T/N b) t(x) T/N ej2ro|> - I-*
Page 45 and 46: 41 A m = e-^sinci^j^t ij = 0 3.17 a
Page 47 and 48: 43 defining the structure of the le
Page 49 and 50: 45 where n is the index of the subs
Page 51 and 52: 47 B Q B mosiac aligned misaligned
Page 53 and 54: 49 4.3 Photoresist Deposition Shipl
Page 55: 51 Kfl A) 0 . . t .. .'i'S'l'lTtj
Page 59 and 60: 55 modulation is calculated using E
Page 61 and 62: Figure 4-5 Photographs from a scann
Page 63 and 64: 59 was taken as the distance the kn
Page 65 and 66: 61 SAMPLE 1 t IMAX=40.37% SAMPLE 2
Page 67 and 68: 63 670 nm Laser diode Microlens Arr
Page 69 and 70: 65 1 Experimental data n Ideal Gaus
Page 71 and 72: 67 /OwQ\ xCX /TK X~X Fiber Figure 5
Page 73 and 74: 5.4 Conclusions 69 The design, fabr
Page 75 and 76: Appendix A: MATLAB PROGRAM
Page 77 and 78: theta=4*lammm/pi/dmm; z=0:100; dg=d
Page 79 and 80: 75 4" MASK 1" SQUARE CENTER I NOTES
Page 81 and 82: TWP67 V=2mm H=5mm, 77 TWD671 BL1 AM
Page 83 and 84: 15 J.Jahns and A. Huang, "Planar in
Page 85: "J.L. Vossen and W. Kem, Thin Film
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