Xeon-Phi-Coprocessor-Datasheet
Xeon-Phi-Coprocessor-Datasheet
Xeon-Phi-Coprocessor-Datasheet
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2.1.4 Intel® <strong>Xeon</strong> <strong>Phi</strong> <strong>Coprocessor</strong> Product Family<br />
Table 2-1.<br />
Intel® <strong>Xeon</strong> <strong>Phi</strong> <strong>Coprocessor</strong> Product Family<br />
Notes:<br />
SKU Card TDP (Watts) Cooling Solution 1<br />
3120A 300 Active<br />
3120P / 7120P / SE10P 300 Passive 2,4<br />
7120X / SE10X 300 None 2,3,4<br />
31S1P 270 Passive<br />
7120A 270 Active<br />
7120D 270 None 6<br />
5120D 245 None 5<br />
5110P 6<br />
225 Passive<br />
1. Passive cooling solution uses topside heatsink (vapor chamber and copper fins) and backside aluminum plate. Active<br />
cooling uses on-card dual-intake blower.<br />
2. SE10P/SE10X are limited edition one-time only SKUs.<br />
3. Same performance and card configuration as the 7120P/SE10P but without Intel heatsink or chassis retention<br />
mechanism; allows for custom thermal and mechanical design by users.<br />
4. 7120P/7120X feature Turbo.<br />
5. Dense Form Factor (DFF): Smaller physical footprint than the other Intel® <strong>Xeon</strong> <strong>Phi</strong> coprocessor products, for<br />
innovative platform designs with unique PCI Express* interface, PCI Express* 2.0 specification compliant.<br />
6. Refer to Section 5.1 for note on total card TDP of 5110P.<br />
2.1.5 Intel® <strong>Xeon</strong> <strong>Phi</strong> <strong>Coprocessor</strong> 7120D/5120D(Dense Form<br />
Factor)<br />
The Intel® <strong>Xeon</strong> <strong>Phi</strong> coprocessor 7120D/5120D products, also known as Dense Form<br />
Factor (DFF), are derivatives of the standard Intel® <strong>Xeon</strong> <strong>Phi</strong> coprocessor PCI<br />
Express* form-factor card. The high-level features of the DFFs are:<br />
• Maximum TDP of 270W for the 7120D and 245W for the 5120D<br />
• GDDR on both sides of the card.<br />
• 117.35mm(4.62”) x 149.86mm(5.9”) PCB.<br />
• 230-pin unique edge finger designed to industry standard x24 PCI Express*<br />
connector, PCI Express* 2.0 compliant. The unique edge finger pin definition<br />
requires signal routing on baseboard and 12V filter per card.<br />
• All power to the card is supplied through the connector.<br />
• There is no auxiliary 2x4 or 2x3 power connector on the card.<br />
• Supports vertical, straddle or right-angle mating connectors.<br />
• On board SMC. The manageability features and software capabilities remain the<br />
same as for other Intel® <strong>Xeon</strong> <strong>Phi</strong> coprocessor products.<br />
• To allow for system design innovation and differentiation, Intel will ship only the<br />
assembled and fully functional PCB, without heatsink or chassis retention<br />
mechanism. This allows system designers to implement their own cooling solution<br />
and connector of choice. Due to presence of GDDR5 memory components on the<br />
backside of the DFF board, a custom cooling design must comprehend both sides of<br />
the DFF product.<br />
• Baseboard designers must ensure the signal integrity of all PCI Express* signals as<br />
they pass the connector of choice and reach the connector fingers of the DFF<br />
product.<br />
Document ID Number: 328209 003EN<br />
Intel ® <strong>Xeon</strong> <strong>Phi</strong> <strong>Coprocessor</strong> <strong>Datasheet</strong><br />
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