Xeon-Phi-Coprocessor-Datasheet
Xeon-Phi-Coprocessor-Datasheet
Xeon-Phi-Coprocessor-Datasheet
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If the system is able to provide a temperature lower than 45 o C at the card inlet, then<br />
the total airflow can be reduced according to the graph and table in Figure 3-6.<br />
If the 5110P SKU is powered by a 2x4 and a 2x3 connector, the card can support an<br />
additional 20W of power for maximum TDP of 245W (see Section 2.1.5 for more<br />
details). In this case, the corresponding airflow requirement for cooling the part as a<br />
245W card is shown in Figure 3-8.<br />
3.3.2.2 Airflow Requirement for SE10P/7120P/3120P/31S1P Passive Cooling<br />
Solution<br />
In order to ensure adequate cooling of the SE10P/7120P/3120P 300W and 31S1P<br />
270W SKUs with a 45 o C inlet temperature, the system must be able to provide 33 ft 3 /<br />
min of airflow to the card with 7.2 ft 3 /min on the secondary side and the remainder on<br />
the primary side. The total pressure drop (assuming a multi-card installation conforming<br />
to the PCI Express* mechanical specification) is 0.54 in H 2 O at this flow rate.<br />
If the system is able to provide a temperature lower than 45 o C at the card inlet, then<br />
the total airflow can be reduced according to the graph and table in Figure 3-7.<br />
Intel ® <strong>Xeon</strong> <strong>Phi</strong> <strong>Coprocessor</strong> <strong>Datasheet</strong><br />
22<br />
Document ID Number: 328209 003EN
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