Xeon-Phi-Coprocessor-Datasheet

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Figure 2-5. 7120D/5120D Dense Form Factor, Topside 230 pin connector SMC GDDR Intel Xeon Phi Coprocessor silicon VR inductor VR FET Intel ® Xeon Phi Coprocessor Datasheet 14 Document ID Number: 328209 003EN
3 Thermal and Mechanical Specification 3.1 Mechanical Specifications The mechanical features of the Intel ® Xeon Phi coprocessor are compliant with the PCI Express* 225W/300W High Power Card Electromechanical Specification 1.0. Table 3-1 shows the mechanical specifications of Intel ® Xeon Phi coprocessor passive and active SKUs. Table 3-1. Intel ® Xeon Phi Coprocessor Mechanical Specification Parameter Specification Product Length 247.9mm 1 Primary Side Height Keep-in Secondary Side Height Keep-in 3120A/7120A SKU mass 7120P/SE10P/5110P/3120P/31S1P SKUs mass 7120D/5120D SKUs mass 7120X/SE10X SKUs mass 34.8mm 2.67mm 1400g 1200g 183g 225g Notes: 1. Inclusive of I/O bracket Figure 3-1 shows the mounting holes and Figure 3-2 shows the relevant dimensions of the Intel ® Xeon Phi coprocessor passive and active cards for chassis retention. Refer to the Intel ® Xeon Phi Coprocessor Thermal Mechanical Models for PTC* Creo (previously Pro-Engineer), Icepak and FloTHERM* models. Document ID Number: 328209 003EN Intel ® Xeon Phi Coprocessor Datasheet 15
Page 1 and 2: Intel ® Xeon Phi Coprocessor Datas
Page 3 and 4: Table of Contents 1 Introduction...
Page 5 and 6: List of Tables 1-1 Related Document
Page 7 and 8: 1 Introduction 1.1 Reference Docume
Page 9 and 10: 2 Intel ® Xeon Phi Coprocessor Arc
Page 11 and 12: Figure 2-2. Intel® Xeon Phi Coproc
Page 13: 2.1.4 Intel® Xeon Phi Coprocessor
Page 17 and 18: Figure 3-2 Dimensions of the Intel
Page 19 and 20: Within 50ns of detecting T throttle
Page 21 and 22: 3.3.2 7120P/SE10P/5110P/3120P/31S1P
Page 23 and 24: Figure 3-6 Airflow Requirement vs.
Page 25 and 26: Figure 3-8 Airflow Requirement vs.
Page 27 and 28: Figure 3-10 SE10X/7120X Power Profi
Page 29 and 30: Figure 3-12 5120D Power Profile: Me
Page 31 and 32: Figure 3-14 7120D Power Profile: Me
Page 33 and 34: 3.4.2 Thermal Profile and Cooling T
Page 35 and 36: 3.4.3 Mechanical Considerations •
Page 37 and 38: Figure 3-19 SE10X/7120X Board Botto
Page 39 and 40: Figure 3-21 7120D/5120D Board Botto
Page 41 and 42: 3.5.1 Bracket Installation Steps Fi
Page 43 and 44: 3. Install OEM Bracket. a. Insert t
Page 45 and 46: 4 Intel ® Xeon Phi Coprocessor Pin
Page 47 and 48: 4.2 Supplemental Power Connector(s)
Page 49 and 50: Table 4-2. 5120D (DFF) SKU Pinout B
Page 51 and 52: 4.3.1 Baseboard Requirements of 512
Page 53 and 54: 5 Power Specification and Managemen
Page 55 and 56: Figure 5-2. Some cores are in C0-st
Page 57 and 58: Figure 5-6. Package-C6 and Memory M
Page 59 and 60: Figure 5-8. Intel ® Xeon Phi copro
Page 61 and 62: 6 Manageability 6.1 Intel ® Xeon P
Page 63 and 64: — P-state clamping if the P-state
Page 65 and 66:
The sensors available from the SMC
Page 67 and 68:
The SMC supports a read only IPMI S
Page 69 and 70:
6.6.2.4 Read Description Figure 6-2
Page 71 and 72:
6.6.3.6 General Commands Table 6-7.
Page 73 and 74:
Table 6-12. Set SM Signal Request F
Page 75 and 76:
When the baseboard asserts PROCHOT
Page 77 and 78:
Table 6-25. Table of Sensors Sensor
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