Xeon-Phi-Coprocessor-Datasheet

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Figure 3-17 SE10X/7120X SKU Coprocessor Case Temperature (T case) vs Power 105.0 T case 95.0 85.0 C A
3.4.3 Mechanical Considerations • In the passive Intel ® Xeon Phi coprocessor products, the only component on the card with IHS load is the coprocessor. The compressive load is assumed to be approximately uniformly distributed over the IHS. The minimum load is 23lbf and maximum load is 75lbf. The mean pressure on the IHS is 33lbf. • Hitachi Type7 is recommended as the thermal interface material (TIM). • The gap filler used is the Bergquist 3500S35. • The Intel passive heat sink is designed to nominal gaps of — GDDR: 0.3 +/- 0.1225 mm — VR FETs: 0.511 +/- 0.1225 mm — VR Inductors: 0.5 +/- 0.2 mm Table 3-4 shows the maximum heights of the different components on the SE10X/ 7120X and 7120D/5120D products, along with the heights used in the product board design. Figure 3-18 and Figure 3-19 show the front and back sides of the SE10X/7120X SKU. Refer to the Intel ® Xeon Phi Coprocessor Thermal Mechanical Models document for the SE10X/7120X SKU. Refer to the Intel ® Xeon Phi Coprocessor Dense Form Factor Models document for information on 5120D SKU. Table 3-4. Board Component Heights Block Color 1 Component Height (mils) Min Typ Max PCB Thickness 57 62 70 Coprocessor 171.221 177.992 184.763 GDDR Orange 47 47.25 VR Inductor Yellow 217 217 VR phase controller Coprocessor VR controller GDDR VR controller Capacitor topside Capacitor backside Red 35 39.37 Green 37 37 Pink 35 35.43 Purple 49 49 Light blue 83 83 Notes: 1. Colors are in reference to Figure 3-18, Figure 3-19, Figure 3-20 and Figure 3-21. Document ID Number: 328209 003EN Intel ® Xeon Phi Coprocessor Datasheet 35
Page 1 and 2: Intel ® Xeon Phi Coprocessor Datas
Page 3 and 4: Table of Contents 1 Introduction...
Page 5 and 6: List of Tables 1-1 Related Document
Page 7 and 8: 1 Introduction 1.1 Reference Docume
Page 9 and 10: 2 Intel ® Xeon Phi Coprocessor Arc
Page 11 and 12: Figure 2-2. Intel® Xeon Phi Coproc
Page 13 and 14: 2.1.4 Intel® Xeon Phi Coprocessor
Page 15 and 16: 3 Thermal and Mechanical Specificat
Page 17 and 18: Figure 3-2 Dimensions of the Intel
Page 19 and 20: Within 50ns of detecting T throttle
Page 21 and 22: 3.3.2 7120P/SE10P/5110P/3120P/31S1P
Page 23 and 24: Figure 3-6 Airflow Requirement vs.
Page 25 and 26: Figure 3-8 Airflow Requirement vs.
Page 27 and 28: Figure 3-10 SE10X/7120X Power Profi
Page 29 and 30: Figure 3-12 5120D Power Profile: Me
Page 31 and 32: Figure 3-14 7120D Power Profile: Me
Page 33: 3.4.2 Thermal Profile and Cooling T
Page 37 and 38: Figure 3-19 SE10X/7120X Board Botto
Page 39 and 40: Figure 3-21 7120D/5120D Board Botto
Page 41 and 42: 3.5.1 Bracket Installation Steps Fi
Page 43 and 44: 3. Install OEM Bracket. a. Insert t
Page 45 and 46: 4 Intel ® Xeon Phi Coprocessor Pin
Page 47 and 48: 4.2 Supplemental Power Connector(s)
Page 49 and 50: Table 4-2. 5120D (DFF) SKU Pinout B
Page 51 and 52: 4.3.1 Baseboard Requirements of 512
Page 53 and 54: 5 Power Specification and Managemen
Page 55 and 56: Figure 5-2. Some cores are in C0-st
Page 57 and 58: Figure 5-6. Package-C6 and Memory M
Page 59 and 60: Figure 5-8. Intel ® Xeon Phi copro
Page 61 and 62: 6 Manageability 6.1 Intel ® Xeon P
Page 63 and 64: — P-state clamping if the P-state
Page 65 and 66: The sensors available from the SMC
Page 67 and 68: The SMC supports a read only IPMI S
Page 69 and 70: 6.6.2.4 Read Description Figure 6-2
Page 71 and 72: 6.6.3.6 General Commands Table 6-7.
Page 73 and 74: Table 6-12. Set SM Signal Request F
Page 75 and 76: When the baseboard asserts PROCHOT
Page 77 and 78: Table 6-25. Table of Sensors Sensor

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