Xeon-Phi-Coprocessor-Datasheet

3.4.2 Thermal Profile and Cooling
The simplest cooling mechanism would involve running fans at full speed. For those
custom air-cooled solutions that intend to be economical in fan power usage and
acoustics, Figure 3-16 represents three regions on the SE10X/7120X coprocessor
power consumption curve relevant to system fan control.
Figure 3-16 SE10X/7120X SKU Coprocessor Junction Temperature (T junction) vs Power
105.0
T junction
A 104°C
95.0
Temperature ( o C)
85.0
75.0
C
B
65.0
D
55.0
45.0
0 50 100 150 200
Intel® Xeon Phi Coprocessor Si Power (W)
Region (A-B) on the line represents the minimum necessary performance of a cooling
solution to keep the coprocessor silicon temperature (T junction ) below T throttle of 104°C
(Table 3-2), during high power dissipation. In this region, a cooling solution based on
airflow would ensure the fans are operating at 100% capacity. In region B-C, the
coprocessor power consumption is low enough that the cooling solution may be set to
maintain the junction temperature at a target temperature. Finally, in region C-D, the
coprocessor may need to be cooled to below the target temperature to maintain a
reasonable exhaust air temperature.
Figure Figure 3-17 shows the analogous thermal behavior of T case .
Document ID Number: 328209 003EN
Intel ® Xeon Phi Coprocessor Datasheet
33