Xeon-Phi-Coprocessor-Datasheet

3 Thermal and Mechanical
Specification
3.1 Mechanical Specifications
The mechanical features of the Intel ® Xeon Phi coprocessor are compliant with the
PCI Express* 225W/300W High Power Card Electromechanical Specification 1.0.
Table 3-1 shows the mechanical specifications of Intel ® Xeon Phi coprocessor passive
and active SKUs.
Table 3-1.
Intel ® Xeon Phi Coprocessor Mechanical Specification
Parameter
Specification
Product Length 247.9mm 1
Primary Side Height Keep-in
Secondary Side Height Keep-in
3120A/7120A SKU mass
7120P/SE10P/5110P/3120P/31S1P SKUs mass
7120D/5120D SKUs mass
7120X/SE10X SKUs mass
34.8mm
2.67mm
1400g
1200g
183g
225g
Notes:
1. Inclusive of I/O bracket
Figure 3-1 shows the mounting holes and Figure 3-2 shows the relevant dimensions of
the Intel ® Xeon Phi coprocessor passive and active cards for chassis retention. Refer
to the Intel ® Xeon Phi Coprocessor Thermal Mechanical Models for PTC* Creo
(previously Pro-Engineer), Icepak and FloTHERM* models.
Document ID Number: 328209 003EN
Intel ® Xeon Phi Coprocessor Datasheet
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