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Understanding Infrared Thermography Reading 3

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1. A major area of infrared nondestructive material testing is based on the fact<br />

that:<br />

a. a good structural bond normalizes emittance artifacts.<br />

b. uniform structural continuity provides predictable thermal continuity.<br />

c. a structural void is a good thermal bond.<br />

d. thermal imagers can be made to measure temperature with great accuracy.<br />

2. When analyzing a thermographic image. it is usually possible to distinguish<br />

between an overload condition and a loose connection because:<br />

a. a loose connection will appear cool compared to its surroundings.<br />

b. a loose connection will appear warmer than the wires on either side.<br />

c. an overload will cause a sharper thermal gradient.<br />

d. one side of a loose connection will appear much warmer than the other.<br />

Charlie Chong/ Fion Zhang

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