ANNUAL REPORT 2004 - ELMOS Semiconductor AG

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MANAGEMENT BOARD ELMOS – THE COMPANY THE ELMOS SHARE CORPORATE GOVERNANCE 108 GLOSSARY ANALOG The representation of a physical quantity is called analog if it continuously occurs by a different amount. ASSEMBLY Means the processing of a wafer into a packaged chip. ASIC An Application Specific Integrated Sensor is a circuit developed individually for a specific application as opposed to standard components not configured customer specifically, for example voltage regulators, memory, processors. ASSP An ASSP (Application Specific Standard Product) is an application specific integrated circuit which was developed individually for a specific application and is now offered as a standard product to several cus- tomers. BACKEND MANUFACTURE The backend manufacture is part of the semiconductor production process carried out after the wafer has left the clean room. The examination of the chips on the wafer, burn-in, taping, and functional testing of the assembled components belong to this process. BCD BCD (Bipolar CMOS DMOS) combines the basic ele- ments of bipolar, CMOS, and DMOS (Double-Diffused MOS) process technologies into a complex and uni- versal semiconductor technology. BURN-IN A method for artificial aging of electronic circuits and components used to detect defects at an early stage. BUS A joint communication system allowing the exchange of electronic or optical information. CAN The CAN-BUS (Controller Area Network) is an incident controlled communication system with a transmission rate of up to 1Mbit/s. It is currently the most often used vehicle network. CHIP An electronic circuit containing electric functions rea- lized in semiconductor material. CLEAN ROOM A sealed part of a building where humidity, tempera- ture, and dust particle concentration are precisely monitored and controlled. CMOS Complementary Metal Oxide Semiconductor is the basic technology for the production of microchips with high integration rates and low energy consump- tion. DC-DC (DIRECT CURRENT TO DIRECT CURRENT) A component, a device, or a fitting for the transforma- tion of electric currents and voltage from an input level to an output level.
GROUP STATUS REPORT FINANCIAL STATEMENTS GROUP STRUCTURE GLOSSARY DIGITAL Digital signals are composed of gradual, quantisized, discrete, separate steps, e.g. binary (zeros and ones). DRAM Dynamic Random Access Memory is the memory type most often used in computers. DRAM components lose their data content when electricity is switched off. DSC Dynamic Stability Control corrects skidding motions of a vehicle occurring for example on a slippery road surface. ELECTRONIC CIRCUIT A combination of different electrical components each taking over a specific function in an electrical system. ESP Electronic Stability Program, see DSC. FLASH FLASH memory is similar to RAM in that it is freely ad- dressable. However, FLASH memory does not lose its data when the electricity is turned off. FLEXRAY FlexRay is the future network standard for applica- tions with high requirements. It supports active and passive safety systems as well as synchronous and asynchronous data transmission at a speed of up to 10Mbit/s. FOUNDRY A semiconductor manufacture whose primary busi- ness objective is the production and sale of processed silicon wafers. FRONTEND MANUFACTURE The production of electronic circuits on silicon wafers by means of physical and chemical manufacturing methods under clean room conditions. GPS The Global Positioning System is a satellite-bound system for the determination of terrestrial positions. The analysis of the duration differential of a minimum three independent radio signals can be used for positioning. GYRO SENSOR Gyro or gyroscope sensors are mechanically or micro- mechanically constructed sensors able to detect ro- tary and rolling motions, for example of vehicles and airplanes, by analyzing the Coriolis force. HALIOS® HALIOS® (High Ambient Light Independent Optical System) is characterized by the recording of three- dimensional motion. Optical outside influences such as strong incidence of light do not affect the perfor- mance. The electronic compensation of external light influence is the technically deciding function. INTEGRATED CIRCUIT, IC An electronic circuit consisting of different, miniatur- ized electronic components (e.g. resistors, capacitors, transistors, etc.) integrated into semiconductor material. elmos annual report 2004 109
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ANNUAL REPORT 2004
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Five-year overview ELMOS Group acco
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ÿ Chronicle 2004 1 ST QUARTER 2 ND
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ÿ Table of contents MANAGEMENT BOA
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MANAGEMENT BOARD ELMOS - THE COMPAN
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ELMOS IS A PART OF YOUR CAR’S FUT
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ELMOS NETWORKS YOUR CAR EFFECTIVELY
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GROUP STATUS REPORT FINANCIAL STATE
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ELMOS ASSISTS YOUR DRIVING At night
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ELMOS ASSISTS YOUR DRIVING Innovati
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ELMOS CONNECTS ELECTRONICS WITH MEC
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ANNUAL REPORT 2004 - ELMOS Semiconductor AG

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