ANNUAL REPORT 2004 - ELMOS Semiconductor AG

GROUP STATUS REPORT FINANCIAL STATEMENTS GROUP STRUCTURE GLOSSARY
ÿ Business and economic framework
Future of automotive electronics
Profit, financial and assets situation
Supplementary report
Risk report
Outlook report
Distinction between
semiconductor,
micromechanics,
and assembly
roughly 57 percent of all assembly services for ELMOS in 2004. Besides the assembly
within the Group, the company also provides the assembly of special packages to
external customers.
Both the software and hardware activities of the HALIOS® inventors and the ELMOS
activities regarding optical sensor systems are combined, optimized, and specifically
marketed under the roof of the company MECHALESS. Because two more percent of
the shares were economically attributable to ELMOS, MECHALESS was fully consoli-
dated in the year 2004 for the first time. The same year numerous order developments
were carried out by MECHALESS. Especially remarkable is the successful development
of an optical input medium for a major producer of telecommunication devices and
the use of HALIOS® sensors for lane detection in an automobile.
attoSENSOR is an engineering office developing innovative inductive sensor systems
for positioning by the use of patented know-how and ASICs by ELMOS. attoSENSOR
products are high resolution encoders for industrial automation technology. The
existing customer contacts were further developed and a large number of multi-
annual serial delivery contracts were signed.
In its segmental reporting ELMOS makes a distinction between the segments semi-
conductor, micromechanics, and assembly. The segment micromechanics consists
of SMI, assembly consists primarily of ELMOS Advanced Packaging. The remaining
companies are recorded under the segment semiconductor. As the Group internal
services provided by ELMOS Advanced Packaging exceed its external activities by far,
ELMOS will discontinue segmental reporting on the segment assembly from 2005
on.
Relationships with affiliated companies
With indirect and direct shareholdings of 57.7 percent, ELMOS Finanzholding GmbH
(EFH) is the major single shareholder of ELMOS Semiconductor AG. Therefore the
Management Board prepared a report on the relationships with affiliated companies
according to § 312 AktG (German Corporations Act) concluding with the following
statement in accordance with § 312 III AktG:
“We declare that, under the circumstances known to us at the time legal trans-
actions were executed and measures were taken, our company received appropriate
consideration for each legal transaction. Disadvantages according to § 312 AktG did
not result for us from our relationships with affiliated companies.”
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