ANNUAL REPORT 2004 - ELMOS Semiconductor AG
ANNUAL REPORT 2004 - ELMOS Semiconductor AG
ANNUAL REPORT 2004 - ELMOS Semiconductor AG
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
MAN<strong>AG</strong>EMENT BOARD <strong>ELMOS</strong> – THE COMPANY THE <strong>ELMOS</strong> SHARE CORPORATE GOVERNANCE<br />
42<br />
<strong>ELMOS</strong> acts from a<br />
sheltered position<br />
Long-term investment budget<br />
The whole investment requirement for the long-term provision of production capa-<br />
city and the requirements of the other companies of the <strong>ELMOS</strong> Group were com-<br />
bined into a multi-annual investment budget. This outline plan allows for invest-<br />
ments to the annual amount of 30 million Euro for the next years.<br />
RESEARCH AND DEVELOPMENT<br />
For the <strong>ELMOS</strong> Group, the non-automotive markets still serve as drivers for innova-<br />
tion as they used to in the past. The automobile industry’s high demands on quality<br />
and reliability of the ICs as well as long development periods leading to serial pro-<br />
duction counteract a fast development of semiconductor technologies. The other<br />
fast-moving markets with short-term product life cycles and different demands on<br />
speed and chip size lead to the establishment of the latest technologies in the short-<br />
est amount of time and in fast succession. Technologies for these innovation driving<br />
markets are used in the automotive semiconductor market only with a significant<br />
delay. <strong>ELMOS</strong> always acts from a sheltered position both on the automotive and on<br />
the consumer and industrial fields, either due to technological reasons or special ap-<br />
plication know-how.<br />
Activities for the development of new process technologies with smaller structure<br />
sizes and FLASH option as well as the further development of the silicon-on-insu-<br />
lator (SOI) technology amount to a part of the expenditure for research and de-<br />
velopment. The technologists’ and process engineers’ research and development<br />
expenditure (R&D) in the year <strong>2004</strong> focused on the product introduction of the 0.5<br />
micrometer high-voltage process technology, the development of the FLASH option,<br />
and the structure minimization (shrink) within the framework of the SOI techno-<br />
logy. Parallel to that several projects for the optimization of component size and<br />
features of important high-voltage components relevant to typical <strong>ELMOS</strong> applica-<br />
tions were carried out. In addition the pre-development of 0.35 micrometer process<br />
technology was begun with. <strong>ELMOS</strong> consistently follows its strategy to offer inno-<br />
vative solutions superior to the competition by use of its own process technology.<br />
Apart from the development of new processes, by far the bigger part of the expendi-<br />
ture for research and development is spent for the development of new products. In<br />
the year <strong>2004</strong> the customers continued to exert pressure towards the supplier taking<br />
over the research and development costs for an ASIC. This means that a majority of<br />
the product development costs must be pre-financed by the ASIC supplier – <strong>ELMOS</strong><br />
– and amortized only through serial unit production. In addition the automobile<br />
manufacturers have seen to it that their suppliers assume responsibility for systems<br />
which they in turn pass on to the second-line suppliers. These obligations are there-