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ANNUAL REPORT 2004 - ELMOS Semiconductor AG

ANNUAL REPORT 2004 - ELMOS Semiconductor AG

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MAN<strong>AG</strong>EMENT BOARD <strong>ELMOS</strong> – THE COMPANY THE <strong>ELMOS</strong> SHARE CORPORATE GOVERNANCE<br />

42<br />

<strong>ELMOS</strong> acts from a<br />

sheltered position<br />

Long-term investment budget<br />

The whole investment requirement for the long-term provision of production capa-<br />

city and the requirements of the other companies of the <strong>ELMOS</strong> Group were com-<br />

bined into a multi-annual investment budget. This outline plan allows for invest-<br />

ments to the annual amount of 30 million Euro for the next years.<br />

RESEARCH AND DEVELOPMENT<br />

For the <strong>ELMOS</strong> Group, the non-automotive markets still serve as drivers for innova-<br />

tion as they used to in the past. The automobile industry’s high demands on quality<br />

and reliability of the ICs as well as long development periods leading to serial pro-<br />

duction counteract a fast development of semiconductor technologies. The other<br />

fast-moving markets with short-term product life cycles and different demands on<br />

speed and chip size lead to the establishment of the latest technologies in the short-<br />

est amount of time and in fast succession. Technologies for these innovation driving<br />

markets are used in the automotive semiconductor market only with a significant<br />

delay. <strong>ELMOS</strong> always acts from a sheltered position both on the automotive and on<br />

the consumer and industrial fields, either due to technological reasons or special ap-<br />

plication know-how.<br />

Activities for the development of new process technologies with smaller structure<br />

sizes and FLASH option as well as the further development of the silicon-on-insu-<br />

lator (SOI) technology amount to a part of the expenditure for research and de-<br />

velopment. The technologists’ and process engineers’ research and development<br />

expenditure (R&D) in the year <strong>2004</strong> focused on the product introduction of the 0.5<br />

micrometer high-voltage process technology, the development of the FLASH option,<br />

and the structure minimization (shrink) within the framework of the SOI techno-<br />

logy. Parallel to that several projects for the optimization of component size and<br />

features of important high-voltage components relevant to typical <strong>ELMOS</strong> applica-<br />

tions were carried out. In addition the pre-development of 0.35 micrometer process<br />

technology was begun with. <strong>ELMOS</strong> consistently follows its strategy to offer inno-<br />

vative solutions superior to the competition by use of its own process technology.<br />

Apart from the development of new processes, by far the bigger part of the expendi-<br />

ture for research and development is spent for the development of new products. In<br />

the year <strong>2004</strong> the customers continued to exert pressure towards the supplier taking<br />

over the research and development costs for an ASIC. This means that a majority of<br />

the product development costs must be pre-financed by the ASIC supplier – <strong>ELMOS</strong><br />

– and amortized only through serial unit production. In addition the automobile<br />

manufacturers have seen to it that their suppliers assume responsibility for systems<br />

which they in turn pass on to the second-line suppliers. These obligations are there-

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