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ANNUAL REPORT 2004 - ELMOS Semiconductor AG

ANNUAL REPORT 2004 - ELMOS Semiconductor AG

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MAN<strong>AG</strong>EMENT BOARD <strong>ELMOS</strong> – THE COMPANY THE <strong>ELMOS</strong> SHARE CORPORATE GOVERNANCE<br />

60<br />

<strong>ELMOS</strong> Group key figures according to US-GAAP<br />

in million Euro unless otherwise indicated Dec. 31, 2003 Dec. 31, <strong>2004</strong> Change<br />

Trade accounts payable 7.9 11.0 38.9%<br />

Amounts payable to banks 17.6 17.8 0.6%<br />

Current portion of long-term obligations 4.0 3.7 – 6.7%<br />

Other current liabilities 9.9 12.7 28.6%<br />

Total current liabilities 39.5 45.2 14.6%<br />

Long-term obligations 38.9 36.1 – 7.1%<br />

Other obligations 2.3 2.2 – 2.9%<br />

Shareholders’ equity 124.7 136.2 9.3%<br />

Total liabilities and shareholders’ equity 205.3 219.8 7.0%<br />

The <strong>ELMOS</strong> Group’s total assets rose from 205.3 million Euro in the year 2003 by<br />

7.0 percent to 219.8 million Euro. The main reason for this increase was the rise in<br />

property, plant and equipment, especially with regard to technical equipment and<br />

machinery. The distribution of the total assets according to segments shows the<br />

semiconductor segment was responsible for the highest increase both in absolute<br />

figures and percentage.<br />

Segmental key figures<br />

in million Euro<br />

unless otherwise indicated Segment Dec. 31, 2003 Dec. 31, <strong>2004</strong> Change<br />

Total assets<br />

Depreciation<br />

Net working capital<br />

Inventories increased from 22.1 million Euro at the beginning of the year under report<br />

to 25.1 million Euro as of December 31, <strong>2004</strong>. The share of the total assets remained<br />

unchanged at roughly eleven percent. The inventory turnover was increased to 2.8<br />

times in <strong>2004</strong>.<br />

<strong>Semiconductor</strong> 148.7 160.5 8.0%<br />

Micromechanics 24.0 24.5 2.0%<br />

Assembly 32.6 34.8 6.6%<br />

2003 <strong>2004</strong><br />

<strong>Semiconductor</strong> 11.3 10.0 – 11.8%<br />

Micromechanics 0.8 0.7 – 18.6%<br />

Assembly 2.4 2.0 – 16.2%

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