ANNUAL REPORT 2004 - ELMOS Semiconductor AG
ANNUAL REPORT 2004 - ELMOS Semiconductor AG
ANNUAL REPORT 2004 - ELMOS Semiconductor AG
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MAN<strong>AG</strong>EMENT BOARD <strong>ELMOS</strong> – THE COMPANY THE <strong>ELMOS</strong> SHARE CORPORATE GOVERNANCE<br />
66<br />
Products tested<br />
several times<br />
The current <strong>ELMOS</strong> production capacity is sufficient for the growth targeted for 2005<br />
and 2006. Parallel to the expansion of the manufacture in Dortmund, the process<br />
transfer to the Fraunhofer Institute in Duisburg was begun with in the year <strong>2004</strong>,<br />
establishing another location for production from 2006 on. With this <strong>ELMOS</strong> gains<br />
access to additional production capacity allowing a maximum 200 wafer starts a<br />
day (200mm wafers), sufficient for the targeted sales increase until the end of this<br />
decade.<br />
PROCUREMENT<br />
The raw materials needed for <strong>ELMOS</strong> production are available from different suppli-<br />
ers worldwide and not subjected to monopolies. A certain dependence on individual<br />
Far East partners in the assembly segment is typical of the trade, though. In this re-<br />
spect, <strong>ELMOS</strong> determined the course for a vertical penetration of the added value<br />
chain by the acquisition of <strong>ELMOS</strong> Advanced Packaging. By the end of <strong>2004</strong> <strong>ELMOS</strong><br />
Advanced Packaging provided approximately 57 percent of the assembly services re-<br />
quired by <strong>ELMOS</strong>. As a consequence <strong>ELMOS</strong> grows increasingly independent from the<br />
Far East partners or rather fluctuations of the US-Dollar.<br />
PRODUCT LIABILITY<br />
ASICs produced by <strong>ELMOS</strong> are integrated as components into complex electronic<br />
systems. Defects and malfunctions of the ASICs produced by <strong>ELMOS</strong> or of the elec-<br />
tronic systems they are integrated into can directly or indirectly be damaging to the<br />
property, health, and lives of third parties. <strong>ELMOS</strong> cannot reduce or exclude liability<br />
in its sales contracts with regard to customers or third parties.<br />
<strong>ELMOS</strong> resolutely follows a zero defect strategy and constantly invests in the detec-<br />
tion and avoidance of sources of error and defects. The individual semiconductor<br />
chips are usually tested even several times at different temperatures with regard to<br />
quality and function inside the plant. Although the company puts to use quality con-<br />
trol systems certified in accordance with TS 16949, VDA 6.1, and QS 9000 and further<br />
comprehensive testing procedures before delivering its products, product defects<br />
might still show only after installation and use of the product by the consumer.<br />
If those product defects materialize, expensive and time-consuming product modifi-<br />
cations might ensue, leading to disrupted customer relationships and a loss of market<br />
shares. A quality problem of whole batches might additionally result in customers’<br />
claims for compensation in the million Euro range. This risk is adequately covered by<br />
insurance. Still all this could affect the company’s assets, financial and profit situa-<br />
tion in a negative way.