ANNUAL REPORT 2004 - ELMOS Semiconductor AG

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MANAGEMENT BOARD ELMOS – THE COMPANY THE ELMOS SHARE CORPORATE GOVERNANCE 14 Close to the customer Where are we going? Company profile Products and applications ÿ Locations ÿ Prospect ÿ Locations We support and advise the customer from his initial idea over its development and first test products to the finished chip. This requires active exchange, many conversa- tions, and fast help if problems occur. We are prepared for this: Our chip production is centralized at our Dortmund headquarters. On roughly 2,500 square meters, every day more than 350 150mm wafers are introduced into manufacturing. Our specialist for sensor systems, SMI in Milpitas, California, runs its manufacture in its own clean room measuring about 1,200 square meters. ELMOS Advanced Packaging (formerly eurasem), based in Nijmegen, Netherlands, takes care of the assembly and connec- tion technology for our chips. Our development centers and sales offices are in close proximity to our customers, for example in Munich, Stuttgart, Paris, or Detroit. In addition semiconductor chips and sensor applications are developed by our subsidiaries MECHALESS in Karlsruhe and Gärtner Electronic Design (GED) in Frankfurt/Oder, and by our cooperation part- ners MAZ Brandenburg in Berlin, DMOS in Dresden, and attoSENSOR in Penzberg. We are always close to the customer. With regard to space and time. ÿ Prospect In the past 20 years electronics revolutionized automobile production. Progress re- garding comfort, safety, and environmental protection was made possible primarily by the use of electronic components. But what electronic progress is going to dis- tinguish tomorrow’s car? Or put another way: How are we going to drive our cars tomorrow? We used our 20-year company anniversary in particular to look ahead, rather than just looking back. To this purpose we invited the doers and thinkers with whom we are going to develop the car of tomorrow. We discussed the future of automotive semiconductor and sensor technology with experts from leading automobile manu- facturers and their suppliers. Electronics in tomorrow’s car will network the separate components intelligently, assist your driving, and fuse mechanical and electronic applications in a way that makes sense.
GROUP STATUS REPORT FINANCIAL STATEMENTS GROUP STRUCTURE GLOSSARY ELMOS networks your car effectively ELMOS assists your driving ELMOS connects electronics with mechanics This means in detail: ÿ An ever-increasing number of functions requires more and more connec- tions between sensors, control devices, and actuators. The separate systems for comfort, safety, and information are networked with each other and standardized. Thereby cars get lighter and more eco-friendly. We are a part of this development as our chips combine several components in a space and cost saving semiconductor. The consequence: Interfaces be- come redundant, standards get established, and problems with electronics are reduced. ÿ Driver assistance systems are the next step on the way to make your driving safer and simpler. While in the past efforts were primarily directed at alleviating the consequences of an accident, now we pay particular atten- tion to the prevention of accidents. But comfort and convenience will be further improved as well: Rain sensors, distance warning devices, and lane detection systems help you concentrate on what’s important: the traffic. Our chips can make an important contribution with their high quality and reliability. ÿ In addition electronics will complete or replace purely mechanical components wherever appropriate. The combination of these elements opens up entirely new possibilities for the reduction of fuel consumption and the improvement of safety. Electrical steering aid, electrical water pump, electrical brake, and electrical valve train belong to this category, among other devices. These products are smaller, lighter, and more efficient, and they only deliver the performance that is required at the given moment. ELMOS is part of your car’s future. We are actively shaping the future. If you want to know more about the automobile’s electronic future or if you are inter- ested in technical details, there is more to be found starting on page 46. elmos annual report 2004 15
Page 1: ANNUAL REPORT 2004
Page 4 and 5: Five-year overview ELMOS Group acco
Page 6 and 7: ÿ Chronicle 2004 1 ST QUARTER 2 ND
Page 8 and 9: ÿ Table of contents MANAGEMENT BOA
Page 10 and 11: MANAGEMENT BOARD ELMOS - THE COMPAN
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GROUP STATUS REPORT FINANCIAL STATE
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FINANCIAL CALENDAR Press conference
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ANNUAL REPORT 2004 - ELMOS Semiconductor AG

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