ANNUAL REPORT 2004 - ELMOS Semiconductor AG

GROUP STATUS REPORT FINANCIAL STATEMENTS GROUP STRUCTURE GLOSSARY
SEMICONDUCTOR
A solid material (e.g. of silicon or germanium) which
can change its electrical characteristics if physically
modified. By well-directed doting of the material, usu-
ally with boron or phosphor, the electronic characte-
ristics are changeable.
SENSOR
An electronic unit measuring or recognizing a real
physical quantity, e.g. motion, heat, or light, and
subsequently converting it into an analog or digital
electric signal.
SILICON, SI
The most common semiconductor material used for
roughly 95 percent of all chips produced.
SMART-POWER
Symbolizes the intelligent use of higher voltage and
currents in an electronic circuit. By the use of smart
power voltage of several 100V and currents up to
several 10A can be realized on a chip.
SOI
Silicon-On-Insulator is a special basic material for
semiconductor manufacture showing a perfect verti-
cal insulation by means of non-conducting interme-
diate layers.
SYSTEM ON CHIP
Progress in semiconductor manufacturing techno-
logy and development methodology make it possible
today to manufacture ASICs with several thousands
of transistors. The idea described as system on chip is
to integrate as many complex functions into a chip as
possible.
TPMS
A Tire Pressure Monitoring System monitors the
automobile’s tire pressure and alerts the driver if the
pressure is too low.
TRANSISTOR
A transistor, or transfer resistor, is the basic compo-
nent of semiconductor technology for the amplifica-
tion or rather control of electronic signals.
UMTS
The Universal Mobile Telecommunications System
allows the effortless exchange of photos, street maps,
and movies between mobile devices.
WAFER
The basic material in chip manufacture. A wafer is
a disc sawn out of a silicon crystal and polished, ap-
proximately 0.3 to 1mm thick. Typical diameters are
150 (6“), 200 (8“), and 300 (12“) mm.
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