ANNUAL REPORT 2004 - ELMOS Semiconductor AG
ANNUAL REPORT 2004 - ELMOS Semiconductor AG
ANNUAL REPORT 2004 - ELMOS Semiconductor AG
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MAN<strong>AG</strong>EMENT BOARD <strong>ELMOS</strong> – THE COMPANY THE <strong>ELMOS</strong> SHARE CORPORATE GOVERNANCE<br />
40<br />
Machine capacity currently at<br />
about 450 wafer starts a day<br />
Sales according to products<br />
Top 10 39%<br />
Others 61%<br />
Dortmund production<br />
line expandable<br />
PRODUCTION AND CAPACITY<br />
Since 1999 <strong>ELMOS</strong> has exclusively manufactured on the 150mm wafer line (corres-<br />
ponds with 6 inches) in Dortmund. This line was expanded in <strong>2004</strong> according to<br />
schedule in order to be prepared for the next technological generations and the<br />
increasing demands on production capacity. Production rooms and facilities are<br />
equipped with the latest technology to allow processes with structure sizes up to<br />
0.35 micrometers. Thereby they provide a solid platform for the <strong>ELMOS</strong> production<br />
of the next ten years. Machine capacity came to roughly 450 wafer starts a day by<br />
the end of the year <strong>2004</strong>, of which about 380 wafer starts a day were used – a utiliza-<br />
tion of roughly 85 percent in comparison with about 70 percent in 2003. More than<br />
120,000 wafers were manufactured altogether in <strong>2004</strong>.<br />
In <strong>2004</strong> about 150 different products with considerable sales volumes were produced<br />
parallel to each other, 21 of which were newly introduced to the production phase.<br />
Therefore a large number of new product starts characterized the year <strong>2004</strong>.<br />
In the assembly segment more than 63 million components were assembled for<br />
<strong>ELMOS</strong> alone, complemented with about five million components for third-party<br />
customers. <strong>ELMOS</strong> Advanced Packaging covered about 57 percent of the assembly<br />
services for <strong>ELMOS</strong> in the whole year <strong>2004</strong>.<br />
The bestselling <strong>ELMOS</strong> product in <strong>2004</strong> was an airbag ignition IC, coming to 6.1<br />
percent of total sales. The ten bestselling products mounted up to 39.3 percent of<br />
sales. All of these were ASICs. In some cases a customer-specific product is delivered<br />
to several customers. This statement, appearing contradictory at first, results from<br />
certain co-developments of products, especially with BMW. These products are then<br />
used in different BMW models via several suppliers. ASSPs are also sold to several<br />
customers.<br />
Future capacity<br />
Providing the production capacity that the future development requires is of the<br />
utmost importance to <strong>ELMOS</strong> as a producing company. Since investments in produc-<br />
tion make up the largest part of the entire investment budget, careful and long-term<br />
planning is necessary. The capacity of the existing production line in Dortmund can<br />
still be expanded by the recruitment of additional staff and further investments in<br />
machines and expansion of space. By the measures initiated in <strong>2004</strong> additional areas<br />
can be devoted to production in the medium term, hence expanding capacity to a<br />
maximum 600 wafer starts a day. This surpasses earlier estimates of a maximum<br />
500 wafer starts daily. Thus sufficient production capacity for the growth planned<br />
for the next two to three years can be provided.