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Advanced CAD System for Electromagnetic MEMS Interactive Analysis

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polyhedra can be directly represented directly in a bRep. The distinguishing characteristic<br />

between these two solid model representations, however, is that a bRep includes analytic<br />

surfaces such as NURBS and swept surfaces.<br />

3.2.3 Surface representation<br />

An important design decision in Geodesic was to use polyhedra instead of analytic surfaces such<br />

as NURBS. The motivation <strong>for</strong> this was twofold. First, boolean operations on analytic surfaces<br />

can be problematic, particularly on the types of surfaces generated by the techniques discussed<br />

later. Second, all of the process simulators used in this work required discretized geometry.<br />

This would require a translation of the simulation results from polyhedra into more complex<br />

analytic representations which can be difficult.<br />

3.2.4 Process emulation vs. process simulation<br />

Often <strong>for</strong> complicated structures, or depending on the versatility of the processing steps allowed<br />

in the package, non-physical process steps must be introduced to be able to create geometry that<br />

mimics what is expected. For example, a common processing step in the fabrication of microdevices<br />

is con<strong>for</strong>mal deposition. However, if your geometry engine cannot per<strong>for</strong>m a con<strong>for</strong>mal<br />

deposition, you can sometimes emulate this process using deposition, planarization, and etching<br />

with additional masks. Two of the examples discussed in section 3.3 highlight the differences<br />

between process emulation and simulation. The reactive ion etching example shows that the<br />

results of emulation can be implementation specific, while the level set example shows the<br />

inability to properly capture rounded corners and the results of select etches using emulation.<br />

3.2.5 Accessibility to algorithms which achieve multiple levels of physical accuracy<br />

Since devices and desired levels of simulation accuracy vary significantly, Geodesic was<br />

designed as an integrated environment to permit varying degrees of physical accuracy. It is<br />

important, particularly from a designer perspective, to have a single tool capable of generating<br />

geometry from the earliest conceptual stage to final production when detailed knowledge of the<br />

fabrication processes can be tweaked <strong>for</strong> higher yield or better reliability. In addition to an<br />

efficient and robust method to create geometry using only solid modeling operations, Geodesic<br />

provides the capability to smoothly incorporate physically based 2-D and 3-D deposition and<br />

etching process simulation results into the geometry. Three key approaches are employed to<br />

achieve varying degrees of physical accuracy: a geometric-based deposition algorithm, domain<br />

decomposition, and level set process simulation (see 3.1.4.3).<br />

First, an efficient geometric-based deposition algorithm (detailed in [30]) and standard solid<br />

modeling operations <strong>for</strong>m the basis of the process emulation capabilities inside of Geodesic.<br />

The algorithm provides <strong>for</strong> surface angle dependent deposition thickness to allow <strong>for</strong> nonuni<strong>for</strong>m<br />

sidewall and step coverage. The algorithm was designed to be independent of the solid<br />

modeling kernel used. Additional details can be found in section 3.4. Second, a domain<br />

decomposition algorithm (detailed in [31]) was created to improve the overall computational<br />

efficiency <strong>for</strong> building complex geometries <strong>for</strong> devices requiring process simulation. The device<br />

is decomposed (using the etch masks) at each deposition or etching step into regions identified as<br />

needing 1-D, 2-D, or 3-D process simulation. Different geometric and physical approaches to<br />

20

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