Advanced CAD System for Electromagnetic MEMS Interactive Analysis

List of Figures
Figure 3-1: Typical design loop for a micro-electro-mechanical switch……………………… 12
Figure 3-2: Schematic of client-server architecture for internet-based prototyping……….….. 14
Figure 3-3: User interface to web-based MEMS prototyping environment…………………... 15
Figure 3-4: Geodesic software architecture………………………………………………….... 17
Figure 3-5: Schematic of canonical RF switch and three different SEM views………………. 22
Figure 3-6: Model created using process simulation and meshed in Geodesic…………….…. 22
Figure 3-7: CIF file for canonical test device…………………………………………….…… 26
Figure 3-8: Idealized reactive ion etch………………………………………………………... 27
Figure 3-9: Schematic of the 4 step process to emulate a reactive ion etch…………………... 29
Figure 3-10: A conformal deposition of using 3-D levelset process simulation………….…… 32
Figure 3-11: Example of a selective corner using 3-D leveset. process simulation…………... 32
Figure 3-12: Two examples of mesh generation………………………………………………. 33
Figure 3-13: Three different MEMS geometries created using Geodesic…………………….. 34
Figure 3-14: Deposit types flow chart…………………………………………………………. 37
Figure 3-15: Three types of deposition………………………………………………………... 37
Figure 3-16: Using the offset solid algorithm in Geodesic……………………………………. 38
Figure 3-17: Etch types flow chart…………………………………………………………….. 39
Figure 4-1: Die schematic of a micro beam specimen ………………………………………... 45
Figure 4-2: SEM micrograph of a free-standing Al micro beam specimen…………………… 45
Figure 4-3: Top view of components of the custom-designed micromechanical testing system 46
Figure 4-4: Stress vs. Strain curves of pure Al and Al-2%Ti micro beams (2mm thick)……... 48
Figure 4-5: TEM cross-sectional view of Al3Ti………………………………………………. 49
Figure 4-6: TEM bright filed image of a grain in a pure Al micro beam…………………….. 49
Figure 4-7: TEM bright field image of a grain in an Al-2%Ti micro beam………………….. 50
Figure 4-8: Stress relaxation of (a) pure Al, (b) Al-2%Ti micro beams (both 2mm thick) …... 51
Figure 4-9: Two-Maxwell-element anelastic model ………………………………………….. 52
List of Tables
Table 3-1: 12 steps in building the canonical switch …………………………………….…… 23
Table 3-2: File size (in bytes) of four example MEMS devices………………………………. 33
Table 3-3: CCPDS commands organized by functionality……………………………….…… 35
Table 3-4: Solid modeling commands required to generate geometry ………………….……. 41
Table 3-5: Solid model object methods required for model generation ……………….……... 41
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