Logbuch_17x24Druck_einzelseiten

88
Weiterführende Techniken
4.
wherein environmental conditions are regulated by providing a regulatable relationship
between vessel and an environment outside vessel.
5.
further comprising placing a plurality of fungal molded shapes in proximal contact with one
another, wherein each of the plurality of fungal molded shapes comprises an outer surface
of mycelium, and wherein each outer surface fuses with the other to form an organic bond.
6.
wherein hydration level is between 33% and 66%.
7.
wherein drying step further comprises dehydrating the fungal molded shape such that
water weight of fungal molded shape is at most 15% of the total weight of fungal molded
shape.
8.
drying step renders fungal inoculum biologically inert.
9.
fungal inoculum is a compressed form of mycelium fungi.
10.
the fungal inoculum is selected from the group of fungal spawn consisting of: Ganoderma
lucidem, Ganoderma tsugae, Ganoderma oregonense, Fomes fomentarius, Trametes versicolor
and Piptoporous betulinus.
11.
comprising the step of pasteurizing lignocellulose based medium for an amount of time,
pasteurizing step terminating subsequent to the termination of mixing step.
12.
the lignocellulose based medium is combined with materials to change qualities and attributes
of the fungal mycelium and the lignocellulose based medium, wherein the materials
are selected from the group consisting of: silica, perlite, methyl cellulose, glycerin, and agarose.
13.
the fungal mycelium is combined with secondary materials to further create structural
connections, mechanical reinforcements, and interfacings within and on the surface of the
molded fungal shape.
14.
comprising pulverizing fungal molded shape into a plurality of small pieces.
15.
comprising the steps of: applying a secondary compressive pressure of at least 100 PSI to plurality
of small pieces; and releasing secondary compressive pressure to plurality of small
pieces.
16.
comprising: applying stress pressure to fungal molded shape such that cracks form in
fungal molded shape and releasing stress pressure such that fungal mycelium is allowed to
grow into cracks in fungal molded shape.
17.
a secondary compressive pressure of at least 100 PSI of pressure to fungal molded shape
after removal from mold; and releasing secondary compressive pressure to fungal molded
shape.
18.
at least one of compressive pressures is sufficient to cause saturated water within the fungal
molded shape to be forced out, and then removing at least one of compressive pressures
and allowing fungal molded shape to expand and naturally absorb an agent.
19.
wherein agent is either a fluid or a gas.
20.
further comprising applying a tertiary compressive pressure of at least 100 PSI to fungal
molded shape.