mitac 8355.pdf - tim.id.au

8355 N/B MAINTENANCE
ACPI 2.0 compliant, including support for processor performance states
Power Supplies
VDD (core): 1.50-V at 52 Amps (max)
VDDIO: 2.5-V at 3.0 Amps (max) for DDR I/O
VLDT: 1.2-V at 0.5 Amps for HyperTransport
VTT: 1.25-V at 0.5 Amps required for 2.5-V I/Os
Target CPU Core Power: 78.00 Watts
Target Maximum Thermal Power: 89 Watts
Electrical Interfaces
HyperTransport. Technology: LVDS-like differential, unidirectional
DDR: SSTL per JEDEC DDR specification
Clock, reset, and test signals also use DDR-like electrical specifications
Packaging
754-pin lidded micro PGA
1.27-mm pin pitch
29x29 row pin array
40mm x 40mm organic substrate, Organic C4 die attach
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