Tystar Oxidation & Anneal Furnace Operation - Login | Nanolab, UCLA

1.0 INTRODUCTION:
This document covers the operation of Tystar's oxidation and anneal tube (Tube 5) located in
UCLA's Nanoelectronics Research Facility. It sits in the left side bank of 4 tubes each of which
has its own heaters, and closed-loop temperature control, associated quartzware and load
system, and each of which has its own gas flow control system. Tube 5 is a general purpose
tube for anneals, drives and oxidations and does not require the same level of cleanliness as
Tube 1. Tube 5 is also of the older style which uses a process controller rather than tube
computer. The tube numbering and process assignments are as follows:
Right side bank
Topmost tube Tube 1 Anneal, Dry & Wet Oxidation- Very clean and
lightly doped samples only
2nd Tube from top Tube 2 Silicon Nitride (standard or low stress)
3rd Tube from top Tube 3 Polysilicon (doped or undoped)
Bottom tube Tube 4 Low Temp Oxide (LTO-doped or undoped)
Left Side Bank
Topmost tube Tube 5 Anneal, Drive and Oxidation for
heavy doped samples
2 nd Tube from top Tube 6 Currently not used
3 rd Tube from top Tube 7 Currently not used
Bottom Tube Tube 8 N2 sinter or Vacuum anneal (350-600C)
This system uses hazardous gases and high temperatures and therefore could cause serious
injury if any action is attempted without THOROUGHLY understanding the system. Refer to
the appendix (LPCVD Furnace Shut Down and Emergency Procedures) for safety related
information.
NOTE: While tubes 2,3 and 4 are LPCVD furnaces utilizing vacuum and toxic gases, tube 1
and 5 are atmospheric furnaces that do NOT use a pump or any kind of vacuum. They also do
NOT use any toxic gases and are therefore simpler systems to run than the other tubes. Tube
1 and 5 do use hydrogen and oxygen which are very flammable and potentially explosive
gases, however.
Successful deposition requires extreme cleanliness for anything that goes directly into the tube
or anything that touches anything which goes into the tube. Therefore:
• NEVER touch boats or wafer with your hands even if you are wearing gloves.
Use ONLY the appropriate boat holder. Boat Holder must be clean also.
• Use ONLY clean tweezers or vacuum wand dedicated for that tube. Clean these
implements often using alcohol, DI water and clean wipes.
• ALWAYS clean wafers using either piranah or RCA type clean right before loading
them into the tube. (NOTE: For the LTO tube ONLY a substitute clean for metallized
wafers may be used, otherwise the metal may be attacked.) Wafers must be Clean
and Dry. Use spin rinse dryer whenever possible. Never load a contaminated wafer
or boat into the tube as this will contaminate the tube as well.
• Wafers and boats coming out of the tube are extremely hot. Do NOT set them on
clean wipes, vinyl gloves or anything else which will melt. Set hot items on clean
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