NeuLAND - FAIR

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Figure 5.11.: Shown is a fully assembled read-out chain, as currently in use for LAND: on the left hand side, the TRIPLEX board on top of the frontend card, in the middle the TacQuila main board with the QDC piggy-back, and on the right hand side the connection for low-voltage supply. For the implementation of TacQuila for NeuLAND two major further developments are underway. First, the TAC stage shall be replaced by a high-resolution Time-to-Digital Converter (TDC) [Bay-10] in a Field-Programmable-Gate-Array (FPGA). By that, we overcome the limited availability of dedicated TAC-ASICs. Second, the layout of the NeuLAND double-planes demands the read-out of 200 signals in 4 corners of the frame structure. Thus an upgrade of the TacQuila board from currently 16 to 50 channels is envisaged, in order to fulfill the space constraints, see figure 5.10. 5.4.2. High-Voltage Distribution System For NeuLAND 6000 photomultiplier need to be supplied with high voltages of typically 1 to 2 kV, with a maximum current of 2-3 mA per channel. For the first NeuLAND submodules, conventional high voltage (HV) supplies are used, i.e. a Multichannel Power Supply System SY1527, CAEN 1 , similarly to the supply of the existing LAND detector. For the full detector solution, an optimized solution is under development, namely a HV 1 http://www.caen.it/csite/CaenProd.jsp?parent=20&idmod=122 74
Figure 5.12.: The photo shows the TacQuila-based read-out of the LAND detector, comprising 480 channels in 3 crates. In the lower part of the rack, the lowvoltage supplies for TacQuila are hosted. supply, which will be integrated into the socket of each photomultiplier voltage divider. A similar supply has been realized earlier for the photomultipliers of the Crystal Ball detector, which is part of the LAND setup 2 . An integrated solution is favoured for two reasons, namely space and power consumption. First, compared to cables and connectors required for the supply of high voltages, typical cables and connectors for the control of the integrated HV supply inside the photomultiplier socket, are much smaller and more flexible. Second, the power consumption and thus heat dissipation, are typically reduced by one order of magnitude for integrated solutions. 2 http://www.iseg-hv.com/download.php/500/file url en/iseg PHQ.pdf 75
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FAIR/NUSTAR/R 3 B/TDR NeuLAND Techn
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Germany EMMI and FIAS: Enrico Fiori
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INR Moscow: Alexander Botvina Russi
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Contents Executive Summary 11 1. In
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B.7. MRPC Solution using Glass as C
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Apart from the excellent energy res
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processes in the universe, such as
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decaying into 24 O plus 4 neutrons
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2. Physics Scenarios: Requirements
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e studied at R 3 B at FAIR include
Page 23 and 24: all theoretical calculations predic
Page 25 and 26: at the surface of the nucleus. The
Page 27 and 28: the evolution of fission channels (
Page 29 and 30: 3. Summary of NeuLAND Prototype Res
Page 31 and 32: counts 70 60 50 40 30 20 10 0 15 15
Page 33 and 34: Figure 3.4.: Shown is the time reso
Page 35 and 36: 4. Monte Carlo Simulations Within t
Page 37 and 38: normalized counts normalized counts
Page 39 and 40: GEANT3 interface. Here, we compare
Page 41 and 42: Counts 1000 900 800 700 600 500 400
Page 43 and 44: counts 5 10 4 10 3 10 2 10 10 LAND
Page 45 and 46: incident neutron fully active detec
Page 47 and 48: investigated. Three values for the
Page 49 and 50: spectrum, absorption length, refrac
Page 51 and 52: Counts 600 500 400 300 200 100 with
Page 53 and 54: Since, as discussed above, several
Page 55 and 56: events 800 600 400 200 0 0 200 400
Page 57 and 58: clusters N 100 50 0 0 500 1000 1500
Page 59 and 60: In the following section we discuss
Page 61 and 62: events 15000 10000 5000 input outpu
Page 63 and 64: events 2000 1500 1000 500 σ = 15 k
Page 65 and 66: 5. Technical Specifications and Des
Page 67 and 68: construction, or for subsequent rep
Page 69 and 70: positioning of 50 submodules mounti
Page 71 and 72: Figure 5.6.: Detector frame with fi
Page 73: 5.4. Peripheral Systems 5.4.1. Read
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Page 81 and 82: 8. Calibration 8.1. Calibration wit
Page 83 and 84: Figure 8.3.: ToF distribution in 10
Page 85: Figure 8.4.: Event display for seve
Page 89 and 90: 10. Installation procedure, its Tim
Page 91: 11. Cost and Funding 11.1. Cost Est
Page 94 and 95: The timeline for milestone 1 includ
Page 96 and 97: 96 2. Sample Tests Random samples o
Page 98 and 99: PNPI St. Petersburg: G.D. Alkhazov,
Page 100 and 101: HV 1.$ mm 2$ mm 0+$1-2)-2'.%/ 5%4'.
Page 102 and 103: Beamline Be exit window P 6 P 3 P 4
Page 104 and 105: B.3. Design Issues Addressed with 4
Page 106 and 107: Time [ns] Counts 41 40 39 2200 2000
Page 108 and 109: Efficiency 100 80 60 40 20 0 7.5 8
Page 110 and 111: 200 AMeV, Erel = 100 keV emitted %
Page 112 and 113: B.7. MRPC Solution using Glass as C
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Page 116 and 117: [Bot-04] S. Botvina andI.N. Mishust
Page 118 and 119: [Lip-03] C. Lippmann, PhD Thesis, U
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NeuLAND - FAIR

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