REVISTA ROMÃNÄ DE AUTOMATICÄ - IPA SA
REVISTA ROMÃNÄ DE AUTOMATICÄ - IPA SA
REVISTA ROMÃNÄ DE AUTOMATICÄ - IPA SA
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36<br />
<strong>REVISTA</strong> ROMÂNĂ <strong>DE</strong> AUTOMATICĂ<br />
a. b.<br />
The apertures with tombstoning were type 2<br />
for 0.125 stencil (figure 6a-0603 case, OSP<br />
finished) and for 0.150 stencil, type 1 (figure<br />
6b-0402 case, OSP finished, 6d-0402 case,<br />
NiAu finished), also type 2 for NiAu , 0603<br />
case and 3, 4, for chemical Tin.<br />
Fig. 7. VPS thermal profile<br />
c. d.<br />
Fig. 6a-d. Solder joints follow up apertures type<br />
For NiAu pads finished, cases type 0402,<br />
0.150mm stencil, the number of tombstoning<br />
was bigger, but at the limits, with a small<br />
angle lifting. It is important that NiAu for<br />
0.125 stencil, chemical silver and HASL for<br />
both stencils have not tombstoning. The<br />
solder joints resulting after stencils apertures<br />
type 2 and 3 present to much solder. In<br />
connection to the tombstoning results, the<br />
conclusion is that 2 and 3 apertures type<br />
especially on 0.150mm stencil, NiAu pads<br />
finished and case smaller than 0805, must be<br />
avoided. The parameters of VPS process are<br />
position on levels, period on position and<br />
heating power. The SLC504 machine offers<br />
20 levels with 0 – 100% power range. In<br />
order to obtain the optimum thermal profile,<br />
the authors used temperature sensors to<br />
measure temperatures distributions on pcb<br />
surface. The result emphasizes differences<br />
between temperatures measured on PCB<br />
surface and machine reference temperature.<br />
Tab. 3. Tombstoning for 0.125 Stencil Printing<br />
Tab. 4. Tombstoning for 0.150 Stencil Printing