PowerPC 740 and PowerPC 750 Microprocessor Datasheet - IBM

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PowerPC 740 and PowerPC 750 MicroprocessorCMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2Electrical and Thermal CharacteristicsDC Electrical CharacteristicsThe 750 60x bus power supply can be either 3.3V, 2.5V, or 1.8V nominal; likewise, the L2 power supply canbe either 3.3V, 2.5V, or 1.8V nominal. See the pinout listing for more informationAbsolute Maximum Ratings See NotesCharacteristic Symbol Value UnitCore supply voltage V DD - 0.3 to 2.2 VPLL supply voltage AV DD - 0.3 to 2.2 VL2 DLL supply voltage L2AV DD - 0.3 to 2.2 V60x bus supply voltage OV DD(3.3V) - 0.3 to 3.6 VOV DD(2.5V) - 0.3 to 2.8OV DD(1.8V) - 0.3 to 2.1L2 bus supply voltage L2OV DD - 0.3 to 3.6 VInput voltage V IN(3.3V) - 0.3 to 3.6 VV IN(2.5V) - 0.3 to 2.8V IN(1.8V) - 0.3 to 2.1Storage temperature range T STG - 55 to 150 °CNote:1. Functional and tested operating conditions are given in Table ”Recommended Operating Conditions,” below. Absolute maximum ratings are stress ratingsonly, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanentdamage to the device.2. Caution: V IN must not exceed OV DD by more than 0.3V at any time, including during power-on reset. This is a DC specification only. V IN overshoot transientsup to OV DD +1V, and undershoots down to GND-1V (both measured with the 740 in the circuit) are allowed for up to 5ns.3. Caution: OV DD must not exceed V DD /AV DD by more than 2.0V at any time during normal operation. On power up and power down, OV DD is allowed toexceed V DD /AV DD by up to 3.3V for up to 20 ms, or by up to 2.5V for 40 ms. Excursions beyond 40 ms or 3.3V are not allowed.4. Caution: V DD /AV DD must not exceed OV DD by more than 0.4V during normal operation. On power up and power down, V DD /AV DD is allowed to exceedOV DD by up to1.0V for up to 20 ms, or by up to 0.7V for 40 ms. Excursions beyond 40 ms or 1.0V are not allowed.9/6/2002 Version 2.0 Page 10
PowerPC 740 and PowerPC 750 MicroprocessorCMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2Recommended Operating ConditionsCharacteristic Symbol Value Unit NotesCore supply voltage V DD See Note 2 V 1, 2PLL supply voltage AV DD V DD V 1L2DLL supply voltage L2AV DD V DD V 160x bus supply voltage, pin W1 tied high OV DD(3.3V) 3.135 to 3.465 V 160x bus supply voltage pin W1 tied to HRESET OV DD(2.5V) 2.375 to 2.625 V 160x bus supply voltage, pin W1 tied to GND OV DD(1.8V) 1.71 to 1.89 V 1L2 bus supply voltage, pin A19 tied high L2OV DD(3.3V) 3.135 to 3.465 V 1L2 bus supply voltage, pin A19 tied to HRESET L2OV DD(2.5V) 2.375 to 2.625 V 1L2 bus supply voltage, pin A19 tied to GND L2OV DD(1.8V) 1.71 to 1.89 V 1Input voltage (Under AC conditions, inputs must go rail-torailfor maximum AC timing performance.)V IN(60X) GND to OV DD V 1V IN(L2) GND to L2OV DD V 1Die-junction temperature T J -40 to 105 °C 1, 2Note:1. These are recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed.2. V DD and T J are specified by the Application Conditions designator in the part number. See the Part Number Key on page 51 for more information.Package Thermal Characteristics 1Characteristic Symbol 740 750 UnitThermal resistance, junction-to-case (top surfaceof die) typicalθ JC0.03 0.03 °C/WThermal resistance, junction-to-balls, typical θ JB 3.8 - 7.1 2 3.8 - 7.6 2 °C/WThermal resistance, junction-to-ambient, at airflow,no heat sink, typical50 FPM 16.0 15.1 °C/W100 FPM 15.4 16.4 °C/W150 FPM 14.9 14.2 °C/W200 FPM 14.4 13.7 °C/WPackage Size 21 x 21 25 x 25 mm 2Die Size 5.12 x 7.78 5.12 x 7.78 mm 2Note:1. Refer to Section “Thermal Management Information,” on page 45 for more information about thermal management.2. 3.8°C/W is the theoretical θ JBmounted to infinite heat sink. The larger number applies to a module mounted on a 1.8 mm thick, 2P card using 1 oz copperpower/gnd planes, with an effective area for heat transfer of 75mm x 75mm.The 750 incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-to-analogconverter, comparator, control logic, and dedicated special-purpose registers (SPRs). See the PowerPC740 and PowerPC 750 User’s Manual for more information on the use of this feature. Specifications for thethermal sensor portion of the TAU are found in the table below.Page 11 Version 2.0 9/6/2002
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PowerPC 740 and PowerPC 750 Microprocessor Datasheet - IBM

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