PowerPC 740 and PowerPC 750 Microprocessor Datasheet - IBM

More documents

Recommendations

Info

PowerPC 740 and PowerPC 750 MicroprocessorCMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2PowerPC 740 PackagePackage TypeCeramic Ball Grid Array (CBGA)Package outline21 x 21mmInterconnects 255 (16 x 16 ball array - 1)Pitch1.27mm (50mil)Minimum module height 2.45mmMaximum module height 3.00mmBall diameter0.89mm (35mil)9/6/2002 Version 2.0 Page 30
PowerPC 740 and PowerPC 750 MicroprocessorCMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2Mechanical Dimensions of the PowerPC 740 255 CBGA PackageFigure 15. Mechanical Dimensions and Bottom Surface Nomenclature of the 255 CBGA PackageA1 CORNERTop ViewD2X0.2ANOTES:1. DIMENSIONING AND TOLERANCING PERASME Y14.5M, 1994.2. DIMENSIONS IN MILLIMETERS.3. TOP SIDE A1 CORNER INDEX IS AMETALIZED FEATURE WITH VARIOUSSHAPES. BOTTOM SIDE A1 CORNER ISDESIGNATED WITH A BALL MISSING FROMTHE ARRAY.MILLIMETERSEE1DIM MIN MAXA 2.45 3.00A1 0.80 1.00A2 0.90 1.10b 0.82 0.93D 21.00 BSCD1 5.443 BSCe 1.27 BSCE 21.00 BSCE1 8.075 BSCC0.15 C2X0.2BA1 CORNERThere is no ballin the A01 positionX-ray view of ballsfrom top of packagee/2D11 2 3 4 5 6 7 8 9 10111213141516ABCDEFGHJKLMNPRTe255Xbe/2 0.3 C A B0.15 CAA2A1Page 31 Version 2.0 9/6/2002
Page 1 and 2: PowerPC 740 and PowerPC 750Micropro
Page 5 and 6: PowerPC 740 and PowerPC 750 Micropr
Page 29: PowerPC 740 and PowerPC 750 Micropr

PowerPC 740 and PowerPC 750 Microprocessor Datasheet - IBM

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?