PowerPC 740 and PowerPC 750 Microprocessor Datasheet - IBM

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PowerPC 740 and PowerPC 750 MicroprocessorCMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2Figure 11. TRST Timing DiagramTRST5Figure 12. Boundary-Scan Timing DiagramTCKData Inputs6 7Input Data Valid8Data OutputsOutput Data Valid9Data OutputsFigure 13. Test Access Port Timing DiagramTCKTDI, TMS10 11Input Data Valid12TDOOutput Data Valid13 9TDO9/6/2002 Version 2.0 Page 26
PowerPC 740 and PowerPC 750 MicroprocessorCMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2PowerPC 740 Microprocessor Pin AssignmentsThe following sections contain the pinout diagrams for the PowerPC 740, a 255 pin ceramic ball grid array(BGA) package.Figure 14 (in part A) shows the pinout of the PPC 740, a 255 pin Ceramic Ball Grid Array (CBGA) package asviewed from the top surface. Part B shows the side profile.Figure 14. Pinout of the 740 255 CBGA Package as Viewed from the Top SurfacePart AABCDEFGHJKLMNPRT01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16Not to ScalePart BSubstrate Assembly.EncapsulationViewDiePage 27 Version 2.0 9/6/2002
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PowerPC 740 and PowerPC 750 Microprocessor Datasheet - IBM

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